Unlock instant, AI-driven research and patent intelligence for your innovation.

Ultrahigh-speed SPI interface implementation device and method

A technology of SPI interface and implementation method, which is applied in the direction of electrical components, automatic power control, instruments, etc., can solve the problem that the signal delay cannot be ignored, and achieve the effect of accurate test and accurate delay time

Active Publication Date: 2020-06-16
WUHAN JINGLI ELECTRONICS TECH +1
View PDF10 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the needs of the market, it is necessary to design an ultra-high-speed SPI interface with a rate of 50M or higher. The application scenario is not only chip-to-chip on a single PCB, but also involves the communication between two devices separated by a certain distance. Communication is connected by cables, and the signal delay cannot be ignored

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrahigh-speed SPI interface implementation device and method
  • Ultrahigh-speed SPI interface implementation device and method
  • Ultrahigh-speed SPI interface implementation device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 Shown, the present invention comprises a kind of super high-speed SPI interface realization method, comprises the following steps:

[0034] Step 1: The master device configures the phase-locked loop module according to the local clock module, generates the first SPI receiving reference reference clock, and the SPI sending reference reference clock, and sets the first sampling clock and configures multiple clocks according to the first SPI receiving reference reference clock. delay sample time value;

[0035] Optionally, as in figure 2 As shown, the master device configures the phase-locked loop module according to the local clock module to generate the SPI transmission reference reference clock and the SPI reception reference reference clock respectively. For example, the SPI transmission reference reference clock can be selected as: ref_clk_mosi=200MHz, and the SPI reception reference reference clock is :ref_clk_miso=200MHz. The SPI sending referen...

Embodiment 2

[0049] The present invention also includes a kind of ultra-high-speed SPI interface realization device, comprising:

[0050] Clock setting module, the clock setting module includes a local clock module and a phase-locked loop module, the master device configures the phase-locked loop module according to the local clock module, generates the first SPI receiving reference reference clock, SPI sends the reference reference clock, and receives the reference reference clock according to the SPI setting the first sampling clock with reference to the reference clock;

[0051] Delayed sampling time setting module, the delayed sampling time setting module includes configuring a plurality of delayed sampling time values;

[0052] In the sampling module, after the master device sends data to the slave device, it determines the corresponding start sampling timing according to the first SPI receiving reference reference clock and each configured delay sampling time value, and uses the firs...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an ultrahigh-speed SPI interface implementation device and method. The device is applied to main equipment and comprises a clock setting module, a delay sampling time setting module and a sampling module. The method comprises the following steps that main equipment configures a phase-locked loop module according to a local clock module, generates a first SPI (Serial Peripheral Interface) receiving reference reference clock and an SPI sending reference reference clock, sets a first sampling clock and configures a plurality of delay sampling time values; the master equipment determines a corresponding sampling starting time after sending data to the slave device, performs data latching by using a first sampling clock to obtain sampling data, traverses a plurality of delay sampling time values, and judges whether the sampling data can be correctly obtained through the plurality of delay sampling time values at a zero phase; and if correct sampling cannot be carriedout, the phase of the first SPI receiving reference clock is adjusted, a plurality of delay sampling times are utilized again for sampling, and the steps are repeatedly executed until sampling data iscorrectly obtained. According to the invention, the working rate and reliability of the SPI protocol are improved.

Description

technical field [0001] The invention belongs to the technical field of high-speed digital interfaces, and in particular relates to an ultra-high-speed SPI interface realization device and method. Background technique [0002] SPI is the abbreviation of Serial Peripheral Interface (Serial Peripheral Interface). Space-saving, it is because of this easy-to-use feature that more and more chips integrate this communication protocol. The SPI protocol does not specify its working rate, and most users will not exceed 2M when using the SPI interface. On the other hand, most of the SPI interfaces are used for communication between different chips on a single PCB. The signal delay between chips is very small and can be ignored. The low speed and almost zero signal delay make The sampling margin of the SPI data receiver is very large, and the software and hardware design are very simple. [0003] However, due to the needs of the market, it is necessary to design an ultra-high-speed S...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F13/42H03L7/08
CPCG06F13/4282H03L7/08
Inventor 肖哲靖
Owner WUHAN JINGLI ELECTRONICS TECH