Mechanical arm device and method for reducing shaking and vibration of mechanical arm device

A technology of robotic arms and sliding seats, which is applied in the direction of robotic arms, program-controlled robotic arms, conveyor objects, etc., can solve problems such as wafer damage, and achieve the effect of improving stability, improving stability, and subtle changes

Active Publication Date: 2020-06-19
ULTRON SEMICON (SHANGHAI) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a mechanical arm device and a method for reducing its shaking and vibration, which can effectively reduce the vibration when moving the basket, so as to solve the existing problem of reducing the mechanical arm's movement of wafers. There is a problem of wafer damage due to vibration when supporting the basket

Method used

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  • Mechanical arm device and method for reducing shaking and vibration of mechanical arm device
  • Mechanical arm device and method for reducing shaking and vibration of mechanical arm device
  • Mechanical arm device and method for reducing shaking and vibration of mechanical arm device

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Embodiment Construction

[0034] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention will be further explained below in conjunction with specific embodiments.

[0035] See figure 1 with Image 6 , figure 1 Is a schematic diagram of the structure of the robotic arm device of the present invention; Image 6 It is a schematic diagram of the structure of the present invention when clamping the wafer and the basket.

[0036] A mechanical arm device for clamping a wafer pallet for movement, comprising a clamping mechanism 1 for clamping the wafer 6 cradle 7 and a driving mechanism 2 for driving the clamping mechanism 1 for clamping operation The lifting mechanism 3 fixed on the bottom of the driving mechanism 2 for lifting drive and the lateral moving mechanism 4 fixed on the side of the lifting mechanism 3 for lateral movement driving. When clamping and moving, the lateral position is moved and positioned by ...

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Abstract

The invention provides a mechanical arm device and a method for reducing shaking and vibration of the mechanical arm device. The clamping and moving device comprises a clamping mechanism used for clamping the wafer supporting basket, a driving mechanism used for driving the clamping mechanism to conduct clamping operation, a lifting mechanism fixed to the bottom of the driving mechanism and used for lifting driving, and a transverse moving mechanism fixed to one side of the lifting mechanism and used for transverse moving driving. According to the mechanical arm, vibration generated when the supporting basket is moved can be effectively reduced, so that the problem that wafers are damaged due to the fact that vibration exists when a mechanical arm moves the wafer supporting basket in the prior art is solved.

Description

Technical field [0001] The invention relates to the technical field of wafer processing, in particular to a mechanical arm device and a method for reducing its shaking and vibration. Background technique [0002] In the semiconductor wet process equipment, it is basically composed of wafer loading / unloading, cleaning process section, drying process section, pipeline circuit configuration area, and wafer transfer robot arm module. The circle loading / unloading shuttles with each process section to realize the loading and unloading of wafers or batches of wafers in designated sections. The robot arm device module is usually installed on the skeleton and frame of the wet equipment, and is installed through a specific installation mode. However, the robot arm may encounter a variety of motion behaviors such as shaking and vibration during a long and high frequency use cycle. The stress concentration, deflection, and deflection caused by different directions of misalignment phenomena,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67H01L21/687B25J9/00B25J9/10B25J9/12B25J15/02B25J15/08B25J19/02
CPCH01L21/67706H01L21/67766H01L21/68742H01L21/68721H01L21/67253B25J9/0009B25J9/123B25J9/1035B25J15/02B25J15/08B25J19/02
Inventor 邓信甫李志峰庄海云徐铭陈佳炜
Owner ULTRON SEMICON (SHANGHAI) CO LTD
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