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Retaining ring with wave structure on bottom surface and bearing head

A wave structure, retaining ring technology, applied in the direction of work carrier, manufacturing tools, metal processing equipment, etc.

Active Publication Date: 2020-06-23
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In general, in order to pursue the flatness of the bottom surface of the retaining ring, it is necessary to break in when using a new retaining ring so that the flatness of the bottom surface of the new retaining ring can reach the preset requirements. In order to shorten the time of breaking in, such as CN1910012B and other technologies set the bottom surface of the retaining ring to a regular wave structure, but generally require complex tooling combinations such as those disclosed in CN105563306B to produce this type of micro wave structure

Method used

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  • Retaining ring with wave structure on bottom surface and bearing head
  • Retaining ring with wave structure on bottom surface and bearing head
  • Retaining ring with wave structure on bottom surface and bearing head

Examples

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Embodiment Construction

[0024] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions.

[0025] The accompanying drawings in this specification are schematic diagrams, which assist in explaining the concept of the...

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Abstract

The invention discloses a retaining ring with a wave structure on the bottom surface and a bearing head. The retaining ring is composed of an annular part, and the annular part is formed by laminatingand gluing a metal part and a nonmetal part; the annular part comprises a top surface, a bottom surface, an outer side surface and an inner side surface, the top surface is fixedly connected with thebearing head, the bottom surface abuts against a polishing surface, the outer side surface is arranged on the outer side of the annular part and is connected with the top surface and the bottom surface, the inner side surface is arranged on the inner side of the annular part and is connected with the top surface and the bottom surface, and the bottom surface is provided with a liquid supply groove communicating with the inner side surface and the outer side surface; and the top surface is provided with a threaded hole, and the threaded hole is located at the corresponding position of the liquid supply groove.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a retaining ring and a carrying head with a wave structure on the bottom surface. Background technique [0002] Chemical Mechanical Planarization (CMP) is a global planarization ultra-precision surface processing technology. In this polishing method, the substrate is usually attracted to the lower part of the carrier head, and the bottom surface of the substrate with the deposited layer is in contact with the rotating polishing pad. The carrier head rotates in the same direction as the polishing pad under the drive of the driving component and gives the substrate a downward load. ; At the same time, the polishing liquid is supplied between the polishing pad and the substrate, and the material removal of the substrate is realized under the joint action of chemistry and machinery. [0003] The lower part of the carrying head is provided with a ret...

Claims

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Application Information

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IPC IPC(8): B24B37/30B24B37/32B24B57/02
CPCB24B37/30B24B37/32B24B57/02
Inventor 孟松林赵德文王宇
Owner HWATSING TECH
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