Wafer cleaning method and wafer cleaning device

Abstract

The invention discloses a wafer rolling brush cleaning method and a wafer cleaning device. The wafer rolling brush cleaning method comprises: placing a wafer on a wafer support device formed by a driven wheel and a driving wheel; The driving wheel performs the adjustment operation, and the reference position of the driven wheel is determined according to the set rotational speed of the wafer and the rotational speed of the driven wheel; the installation position of the driven wheel is set by the roller adjusting device according to the reference position of the driven wheel; the cleaning brushes located on both sides of the wafer Move to the cleaning position to perform roller brush cleaning on both the front and back of the wafer.

Description

technical field [0001] The invention belongs to the technical field of wafer cleaning, and in particular relates to a wafer cleaning method and wafer cleaning device. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in the process of boosting the transformation and upgrading of the manufacturing industry to digitalization and intelligence. A chip is the carrier of an integrated circuit, and chip manufacturing involves process processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. Among them, chemical mechanical polishing (Chemical Mechanical Planarization, CMP) belongs to a wafer manufacturing process, which is an ultra-precision surface processing technology for global planarization. [0003] After chemical mechanical polishing, the wafer needs to be cleaned and dried to avoid the contamination of semiconductor devices...

AI Technical Summary

Problems solved by technology

The determination and running-in of the support components in the wafer cleaning device consume a lot of time and affect the cleaning efficiency of the wafer

[0006] Furthermore, the gasket is usually made of a non-metallic material with certain flexibility, which will wear out during operation and cause the groove of the gasket to become larger, making the wafer slip in the groove, which is also not conducive to the cleaning of the wafer. Operation monitoring

[0007] In addition, the gasket expands in contact with the chemical liquid in the shell, making the size of the groove smaller, which may cause one of the driving wheels to hang in the air, causing the wafer set on the support assembly to fluctuate from time to time, which will affect Cleaning effect of wafer surface

Images