X-ray glue path measuring device and method
A measurement device and measurement method technology, applied in the field of radiation imaging, can solve problems such as difficult and fast detection, long scanning time, and high price, and achieve significant market application value, accurate glue path imaging on-line detection, and high sensitivity.
Active Publication Date: 2021-07-13
TSINGHUA UNIV
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Problems solved by technology
Conventional X-ray fluoroscopy imaging technology reduces the contrast of the image due to the overlapping of objects on the X-ray path. For the inspection of glue roads, the density of glue is generally lower than that of shells, plastic structural parts, circuit boards, Chips, etc., belong to the detection of weakly absorbing thin-layer objects in the strong absorbing background, and it is difficult to directly identify the glue path from the X-ray fluoroscopy image
Although X-ray CT imaging technology can realize three-dimensional imaging of electronic products through scanning at different angles, and can identify glue paths; but X-ray CT, especially the microfocus cone-beam CT imaging system used for electronic product inspection, is expensive, and the scanning It takes a long time, and it usually takes more than ten minutes to complete the scanning of an electronic product. It is difficult to realize online rapid detection on the production line.
Therefore, the existing technology is difficult to achieve fast, online and accurate measurement of the glue path of electronic products
Method used
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[0037] The embodiments of the present invention will be described below with reference to the drawings. One of ordinary skill in the art will recognize that the described embodiments can be corrected in a variety of different ways or a combination thereof without departing from the spirit and scope of the invention. Accordingly, the drawings and description are essentially illustrative, not the scope of protection of the claims. Further, in the present specification, the drawings are not drawn, and the same reference numerals denote the same part.
[0038] figure 1 It is a flow schematic of the X-ray gum measurement method of the present invention, such as figure 1 As shown, the X-ray glue measurement method of the present invention includes the following steps:
[0039] Step S1, the first X-ray image to be detected is detected;
[0040] Step S2 is compared to the first X-ray image of the adhesive object to be detected and the second X-ray image to be detected, and the third X-ra...
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The invention discloses an X-ray glue path measurement device and method, wherein the device includes: an image acquisition device for acquiring a first X-ray image of an object to be detected with glue; an image processing module for comparing the first X-ray image The radiographic image and the second X-ray image of the glue-free object obtain a third X-ray image of the glue path in the object to be detected; the glue path measurement module obtains the to-be-detected X-ray image according to the measurement of the third X-ray image There is glue path information in the glue object. The invention can realize high-sensitivity, fast and accurate on-line detection of glue path imaging, can be used for online real-time rapid detection of electronic product production lines, and is suitable for glue path detection of all electronic products.
Description
Technical field [0001] The present invention relates to the field of radiation imaging, and in particular, to an X-ray gum measurement device and method. Background technique [0002] At present, adhesive technology represented by dispensing technology is widely used in a series of electronic products such as laptop, tablet, and mobile phones, such as glass screens and housings, display screens, metal casings and internal plastic structures. Equisical with adhesive technology. Dispensing techniques are typically placed on the worksheet or special jug, such as a shell, or the like, according to its own bonding process, according to its own bonding process, etc., the dispensing process is placed. Working parameters such as size and interval operation time, then automatic point glue operation; due to the editable characteristics of the dispensing machine, it can be flexibly applied to the production line of the electronic product component for online bonding. However, in the actual ...
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IPC IPC(8): G01B15/00G01B15/02G01N23/04
CPCG01B15/00G01B15/02G01N23/04
Inventor 李亮陈志强张丽
Owner TSINGHUA UNIV