Vacuum exhausting system and control method thereof

A technology of vacuum exhaust and exhaust pump, applied in pump control, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as damage to vacuum exhaust device 1, stoppage of operation, pollution of wafers and semiconductor processing equipment 200, etc.

Inactive Publication Date: 2020-06-26
XIA TAI XIN SEMICON QING DAO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, when an emergency occurs, the above-mentioned vacuum exhaust device 1 will stop running
The pressure difference between the chamber 210 and the outside causes the chamber 210 to gradually break away from the vacuum state, t

Method used

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  • Vacuum exhausting system and control method thereof
  • Vacuum exhausting system and control method thereof
  • Vacuum exhausting system and control method thereof

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] It should be noted that when an element or component is considered to be “disposed on” another element or component, it may be directly disposed on the other element or component, or there may be an intervening element or component at the same time.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. ...

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PUM

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Abstract

A vacuum exhausting system is used for sustaining a vacuum state in a chamber of semiconductor processing equipment. The semiconductor processing equipment comprises at least one chamber. The vacuum exhausting system comprises at least one exhausting pipeline, an exhausting pump and a switch valve which are arranged on the exhausting pipeline. Each exhausting pipeline is communicated with a chamber. The vacuum exhausting system further comprises a standby pipeline, a control mechanism, a standby pump and a standby switch valve which are arranged on the standby pipeline. The standby pipeline iscommunicated with the chamber. The control mechanism is in communication connection with the switch valve and the standby switch valve. The control mechanism controls the switch valve to switch off the switch valve and switch on the standby switch valve when the current of the exhaust pump is higher than a preset value. The vacuum exhausting system prevents system burndown and prevents a condition of incapability of sustaining the vacuum state of the chamber when the exhausting pump cannot work or is unsuitable for working, thereby ensuring processing yield. The invention further provides a vacuum exhausting system control method.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a vacuum exhaust system and a control method thereof. Background technique [0002] Such as figure 1 As shown, semiconductor processing equipment 200 generally includes at least one chamber 210 . The chamber 210 can be used to perform various processes on wafers, including but not limited to etching process, deposition process, ion implantation and heat treatment. Among them, some processes require the use of specific processing gases, and the gas environment in the chamber 210 often needs to be in a vacuum state. In order to maintain this vacuum state, it is necessary to continuously operate the vacuum exhaust device 1 communicating with the chamber 210 . [0003] However, when an unexpected situation occurs, the above-mentioned vacuum exhaust device 1 will stop operating. The pressure difference between the chamber 210 and the outside causes the chamber 210...

Claims

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Application Information

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IPC IPC(8): F04B37/14F04B49/06F04B49/22F04B51/00H01L21/67
CPCF04B37/14F04B49/06F04B49/22F04B51/00H01L21/67011
Inventor 徐笵植徐康元
Owner XIA TAI XIN SEMICON QING DAO LTD
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