Vacuum exhausting system and control method thereof

Abstract

A vacuum exhausting system is used for sustaining a vacuum state in a chamber of semiconductor processing equipment. The semiconductor processing equipment comprises at least one chamber. The vacuum exhausting system comprises at least one exhausting pipeline, an exhausting pump and a switch valve which are arranged on the exhausting pipeline. Each exhausting pipeline is communicated with a chamber. The vacuum exhausting system further comprises a standby pipeline, a control mechanism, a standby pump and a standby switch valve which are arranged on the standby pipeline. The standby pipeline iscommunicated with the chamber. The control mechanism is in communication connection with the switch valve and the standby switch valve. The control mechanism controls the switch valve to switch off the switch valve and switch on the standby switch valve when the current of the exhaust pump is higher than a preset value. The vacuum exhausting system prevents system burndown and prevents a condition of incapability of sustaining the vacuum state of the chamber when the exhausting pump cannot work or is unsuitable for working, thereby ensuring processing yield. The invention further provides a vacuum exhausting system control method.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a vacuum exhaust system and a control method thereof. Background technique [0002] Such as figure 1 As shown, semiconductor processing equipment 200 generally includes at least one chamber 210 . The chamber 210 can be used to perform various processes on wafers, including but not limited to etching process, deposition process, ion implantation and heat treatment. Among them, some processes require the use of specific processing gases, and the gas environment in the chamber 210 often needs to be in a vacuum state. In order to maintain this vacuum state, it is necessary to continuously operate the vacuum exhaust device 1 communicating with the chamber 210 . [0003] However, when an unexpected situation occurs, the above-mentioned vacuum exhaust device 1 will stop operating. The pressure difference between the chamber 210 and the outside causes the chamber 210...

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Problems solved by technology

[0003] However, when an emergency occurs, the above-mentioned vacuum exhaust device 1 will stop running

The pressure difference between the chamber 210 and the outside causes the chamber 210 to gradually break away from the vacuum state, that is, external gas enters the chamber 210, thereby causing contamination of the wafer and semiconductor processing equipment 200

If the vacuum state is not restored for a long time, it may also cause damage to the vacuum exhaust device 1

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