33results about How to "Guaranteed processing yield" patented technology

A method for forming patterns for semiconductor device includes following steps. A substrate is provided. The substrate includes a hard mask layer and a sacrificial layer formed thereon. A plurality of spacer patterns parallel with each other are formed on the substrate. A plurality of first blocking layers are formed in the sacrificial layer after forming the spacer patterns. A plurality of second blocking layers exposing at least a portion of the sacrificial layer and at least a portion the first blocking layer are formed on the substrate after forming the first blocking layer. Next, the sacrificial layer and the hard mask layer are etched with the spacer patterns, the first blocking layers and the second blocking layer being used as etching masks to form a patterned hard mask layer on the substrate.

The invention discloses an eight-station crankcase stator combination machining device. The eight-station crankcase stator combination machining device comprises an eight-station rotating disc mechanism, crankcase stator combination machining mechanisms, moving sliding table mechanisms, a cooling mechanism and a control mechanism. The eight-station rotating disc mechanism comprises a rotating frame and a rotating disc arranged on the rotating frame. The rotating disc is rotationally connected with the rotating frame. Workpiece tools are arranged on the rotating disc in the circumferential direction in an array manner. The workpiece tools are used for fixing workpieces. The crankcase stator combination machining mechanisms are arranged in the circumferential direction of the rotating disc in an array manner. The moving sliding table mechanisms are arranged at the bottoms of the crankcase stator combination machining mechanisms and used for driving the crankcase stator combination machining mechanisms to move in the radial direction of the rotating disc. The cooling mechanism is used for cooling the crankcase stator combination machining mechanisms and the workpieces. By the adoptionof the eight-station crankcase stator combination machining device, simultaneously continuous machining of multiple workpieces and multiple processes can be achieved, and the machining efficiency andprecision are high.

A die set for grinding circular lens is composed of the first die with a slot on its top surface, and the second die with semi-circular slot. Its method for grinding circular lens includes such steps as providing said die se, fixing the lens in the slot of the first die, grinding the exposed part of the lens to become semi-circular shape, putting the second die on the first one to make the semi-circular part of the lens in the semi-circular slot of the second die, removing the first die, fixing the lens, grinding the exposed part of the lens to become a circular lens and separating the lens from the second die.

The invention discloses an edging and punching method and device capable of achieving automatic alignment. The method comprises the following steps of feeding materials to be processed into a CNC mechanism, and carrying out edging on the materials to be processed, wherein the materials to be processed are arranged in a stacking mode; placing the materials to be processed in a feeding position of an objective table of a laser processing mechanism; acquiring a photo of the materials to be processed through a CCD camera, and converting the photo into data coordinates and sending the data coordinates to a control system; and calculating the required moving distance of the laser processing mechanism and controlling the laser processing mechanism to perform laser processing on the materials to be processed so as to remove the materials through a control system. The materials to be processed are edged in a stacking mode through the CNC mechanism, processing efficiency is guaranteed, the materials to be processed are punched one by one through the laser processing mechanism, the CCD camera is used for assisting in alignment, and processing precision and yield are guaranteed.

The invention relates to a robust adaptive amplitude control method for ultrasonic machining of hard and brittle materials. Firstly, a feedforward compensation mode is designed, and the problem of amplitude variation caused by impedance variation of transducer temperature and matching inductance temperature is solved. And then, in order to ensure the amplitude control precision of the system, eliminate the influence of uncertainty of system parameters and improve the anti-interference performance of the system, a robust adaptive controller is designed to adjust the adaptive control rate on line to ensure the amplitude control precision when the system parameters are uncertain due to the strong coupling association between the ultrasonic amplitude and the resonant frequency. According to the invention, problems in complex processing environments can be solved; the problem of amplitude fluctuation caused by load, process and environment changes, transducer temperature, matching inductance temperature and the like in the machining process is solved. High-precision stable output of the amplitude is achieved through designed strong-coupling robust self-adaptive amplitude control, and the machining precision, the machining process requirement and the machining yield of the hard and brittle materials in the actual machining process are guaranteed.

A vacuum exhausting system is used for sustaining a vacuum state in a chamber of semiconductor processing equipment. The semiconductor processing equipment comprises at least one chamber. The vacuum exhausting system comprises at least one exhausting pipeline, an exhausting pump and a switch valve which are arranged on the exhausting pipeline. Each exhausting pipeline is communicated with a chamber. The vacuum exhausting system further comprises a standby pipeline, a control mechanism, a standby pump and a standby switch valve which are arranged on the standby pipeline. The standby pipeline iscommunicated with the chamber. The control mechanism is in communication connection with the switch valve and the standby switch valve. The control mechanism controls the switch valve to switch off the switch valve and switch on the standby switch valve when the current of the exhaust pump is higher than a preset value. The vacuum exhausting system prevents system burndown and prevents a condition of incapability of sustaining the vacuum state of the chamber when the exhausting pump cannot work or is unsuitable for working, thereby ensuring processing yield. The invention further provides a vacuum exhausting system control method.

The invention discloses a jewelry precision punching plastic burning needle mold. The mold comprises a bottom plate and a first fixed mold, wherein a matching column is fixed to the outer edge of thebottom plate; an assembly hole is formed in the matching column; a bottom panel is arranged on the upper surface of the bottom plate; a stainless steel punching needle is arranged on the upper surfaceof the bottom panel; a second fixed mold is mounted above the first fixed mold; the first fixed mold is located above the bottom plate; a third fixed mold is arranged above the second fixed mold; andlugs are fixed to the outer edges of the first fixed mold, the second fixed mold and the third fixed mold. The jewelry precision punching plastic burning needle mold is formed in a manner that the three fixed molds are superposed together, matched with the circular bottom plate and locked by three fixing screws; a fixed mold plate is formed by one-time injection molding of a precision plastic mold and is made of PC and glass fiber plastic raw materials with the temperature resistance and the high stability; and the circular bottom plate is also formed by one-time injection molding of the precision plastic mold and is made of the same materials the same as that of the fixed mold plate.

The invention discloses a process for eliminating the static electricity of a polaroid. The process comprises the following steps of: 1) selecting a quaternary ammonium salt cationic surfactant, preparing static electricity elimination liquid from the quaternary ammonium salt cationic surfactant and absolute ethyl alcohol in proportion, pouring the static electricity elimination liquid into a special container, making a mark, and avoiding contact with skin in the process, otherwise, washing the skin with clear water in time; (2) manufacturing a cleaning tool by using dust-free cloth and a special fixture, forbidding the exposure of edge opening of the fixture, so as to avoid scratches caused by direct contact between the fixture and the polaroid in a subsequent process; and (3) taking a supplied polaroid, removing inner and outer packages, flatly placing the polaroid on a working table, and confirming that a release film faces upward. The invention belongs to the technical field of displays. With the process for eliminating the static electricity of the polaroid adopted, the static electricity of the polaroid is reduced to be (-) 0.2 KV or below, and the phenomena of polaroid adhesion and polaroid connection do not occur in the polaroid machining process and before the attachment of the polaroid to a client.

The invention provides a device for LED wafer processing, which comprises a carrying disc and a pressing ring, the side surface of the carrying disc is an inclined surface, a carrying disc inclination angle is formed between the side surface of the carrying disc and a wafer placing surface, the pressing ring is used for fixing the carrying disc, a pressing ring positioning angle is used for positioning the carrying disc inclination angle, and a sheet pressing part is used for pressing the edge of the carrying disc. The shape and the angle of the press ring positioning angle are matched with the shape and the angle of the carrier plate inclination angle, the size of the carrier plate is properly increased, meanwhile, the problem that the press ring cannot press the carrier plate due to the fact that the carrier plate is too large is avoided, a machine table can work normally, and the phenomenon that the carrier plate is prone to deviating from fixation of the press ring in the process that the carrier plate is conveyed into a cavity in the manufacturing process and rubs with the press ring can be avoided. The service life of the carrying disc and the wafer processing yield can be effectively guaranteed, and stable large-scale mass production is achieved.

The invention discloses a bending forming device. The bending forming device comprises a top plate, wherein a forming mechanism is fixedly arranged at the top of the top plate. The forming mechanism comprises a cylinder, wherein the top end of the cylinder is sleeved with a rotating column, a barrel body is fixedly arranged at the top of the rotating column, two first openings are formed in the top of the barrel body, a first push rod is fixedly arranged at the top of the rotating column, a second push rod is arranged on one side of the first push rod, and a material supporting support is arranged on one side of the cylinder. By rotating a handle, the handle lifts the rotating column to drive the first push rod and the second push rod to rotate, in the process, a plate is slowly pushed to the position of a positioning pin till the outer wall of the plate makes contact with the outer wall of the barrel body, the outer wall of the first push rod and the outer wall of the second push rod at the same time, and the two different positions of the plate are bent and formed at a time. The bending forming device can be fixed on a stand, the machining yield is ensured, the efficiency is improved, and the cost is saved.

The embodiment of the invention discloses an OLED (Organic Light Emitting Diode) display device and a manufacturing method thereof. The OLED display device comprises a substrate, a plurality of OLED devices and a plurality of spacers, the plurality of OLED devices are arranged on the substrate, and one side, far away from the substrate, of at least part of the OLED devices is provided with an inorganic layer; and at least part of the spacers are distributed in gaps between the OLED devices. The OLED display device provided by the invention is provided with the spacer, so that the problem that the display quality of the OLED display device is reduced due to external impact is avoided.

The invention provides a large-bevel-edge 2.5 D cover plate machining device and method, and relates to the field of glass machining and manufacturing, the large-bevel-edge 2.5 D cover plate machining device comprises a cover plate fixing mechanism, a first grinding wheel rod and a second grinding wheel rod, the first grinding wheel rod is provided with a first cutting edge face, and the first cutting edge face is a first conical face with the large upper portion and the small lower portion; the second grinding wheel rod is provided with a second cutting edge surface and a third cutting edge surface which are consistent in shape, the second cutting edge surface comprises a second conical surface, a third conical surface, a fourth conical surface, a cylindrical surface and a fifth conical surface which are sequentially connected from top to bottom, and the roughness of the first cutting edge surface, the second cutting edge surface and the third cutting edge surface is sequentially reduced. A large bevel edge is machined at a time through the first cutting edge face, a contour is formed at the upper position and the lower position of the large bevel edge at a time through the second cutting edge face, and finally the contour of a rough product is finely trimmed through the third cutting edge face, so that the cover plate is obtained through complete forming, and beveling trimming is not needed. The processing yield and the processing efficiency are higher, and the standard reaching rate of the product size and the processing precision are improved.

The embodiment of the invention discloses a production line automatic parameter adjusting device and a production line parameter adjusting method. The production line parameter adjusting device comprises a sampling module used for collecting product processing parameters and equipment point position parameters; and a data analysis module used for determining whether processing equipment performs point location adjustment or not according to the product processing parameters and the equipment point location parameters, and further used for determining point location adjustment parameters of theprocessing equipment when the processing equipment needs to perform point location adjustment, and feeding back the point location adjustment parameters to the processing equipment. According to thetechnical scheme of the embodiment of the invention, the equipment processing yield is ensured in a production line of the electronic and semiconductor industries, and the productivity is improved.

The invention discloses copper part thin-wall fine punching equipment. The copper part thin-wall fine punching equipment comprises a machine table, a feeding device, a feeding conveying channel, a punching device, a discharging conveying channel, a discharging device, a first material tray device and a second material tray device. The feeding device, the feeding conveying channel, the punching device, the discharging conveying channel, the discharging device, the first material tray device and the second material tray device are arranged on the machine table; the first material tray device isused for placing a first material tray, and the first material tray is used for bearing a to-be-punched workpiece; the second material tray device is used for placing a second material tray, and the second material tray is used for bearing the punched workpiece; the feeding device is arranged on one side of the feeding conveying channel and is configured to convey the to-be-punched workpiece on the first material tray to the feeding conveying channel; the feeding conveying channel is configured to convey the to-be-punched workpiece to the punching device; the punching device is configured to punch the to-be-punched workpiece; the discharging conveying channel is configured to output the punched workpiece; and the discharging device is arranged on one side of the discharging conveying channel and used for conveying the punched workpiece to the second material tray. The equipment can realize fine punching, and is high in production efficiency and high in automation degree.