Grinding dynamometer for ultra-precise silicon chip

Abstract

The invention relates to a grinding dynamometer for an ultra-precise silicon chip. The grinding dynamometer for the ultra-precise silicon chip comprises an inner shaft, a grinding wheel, a three-dimensional force measurement platform and a sensing system signal processor. The measured silicon chip is fixed to the three-dimensional force measurement platform. The grinding wheel is fixed to the inner shaft to be used for grinding the measured silicon chip. The three-dimensional force measurement platform transmits grinding force in the machining process to the sensing system signal processor. The three-dimensional force measurement platform comprises an X-direction differential capacitor unit combination and a Y-direction differential capacitor unit combination. The X-direction differential capacitor unit combination and the Y-direction differential capacitor unit combination each comprise two or more capacitor unit modules which mutually form differentials. Each capacitor unit module is of a comb-shaped structure composed of two or more strip-shaped capacitor units. The dynamic characteristics of a grinding machine and the grinding performance of the grinding wheel are monitored, and the technological parameters such as the feeding speed of the grinding wheel are adjusted in real time according to the grinding force.

Description

technical field [0001] The invention belongs to the field of precision instrument processing, relates to ultra-precision silicon wafer processing, and in particular relates to a grinding force measuring instrument for ultra-precision silicon wafers. Background technique [0002] In the process of ultra-precision grinding of silicon wafers, on the one hand, the grinding force directly reflects the grinding state such as grinding vibration and grinding wheel wear; Moreover, it will cause damage to the grinding surface of the silicon wafer, which has a great impact on the surface quality of the silicon wafer processing, especially in the back grinding and thinning of the silicon wafer, because the thickness of the silicon wafer is getting thinner and thinner, the change of the grinding force is extremely It is easy to cause silicon wafers to be broken. Therefore, in the process of grinding silicon wafers, the dynamic signal of the grinding force is detected online, the dynamic ...

AI Technical Summary

Problems solved by technology

However, the existing grinding dynamometers have their own application ranges and conditions of use, and their use has relatively large limitations. Some foreign dynamometers have high process requirements and high costs, and are not suitable for widespread use.

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