Multi-die packaging structure for high power
A multi-die packaging and high-power technology, which is applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of high maintenance costs of power modules, improve independence, reduce maintenance costs, and improve work reliability sexual effect
Pending Publication Date: 2020-06-26
MACMIC SCIENCE & TECHNOLOGY CO LTD
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Problems solved by technology
[0003] In order to solve the problem of high maintenance cost of power modules, the present invention provides a packaging structure for high-power multi-die
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0024] Such as Figure 1-8 As shown, a high-power multi-die packaging structure 100 according to an embodiment of the present invention includes a substrate 1, a lead frame 2 and a plastic package 3, and is characterized in that the lower surface of the substrate 1 is covered with an underlying metal conductor plate 4, The upper surface of the substrate 1 is covered with a first metal-clad conductor plate 5 and a second metal-clad conductor plate 6 arranged at...
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The invention belongs to the technical field of power modules. In order to solve the problem of high maintenance cost of a power module, the invention provides a multi-die packaging structure for highpower. The packaging structure comprises a substrate, a lead frame and a plastic packaging shell, wherein the lower surface of the substrate is covered with a metal-clad conductor plate, the upper surface of the substrate is covered with a first metal-clad conductor plate and a second metal-clad conductor plate which are arranged at an interval, the first metal-clad conductor plate is provided with at least one first chip and at least one second chip, and the first chip is electrically connected with the second metal-clad conductor plate through a metal wire; the lead frame is arranged abovethe substrate and extends in the circumferential direction of the substrate, the plastic package shell wraps the substrate and the lead frame, and the first power terminal, the second power terminal,the first signal terminal and the second signal terminal extend out of the plastic package shell. According to the invention, convenience is provided for assembling of high-power multi-tube-core packaging, the maintenance cost can be reduced, and the working reliability of the power module can be improved.
Description
technical field [0001] The invention belongs to the technical field of power modules, and in particular relates to a packaging structure for high-power multi-tube cores. Background technique [0002] In the existing technology, the demand for high voltage and high current of the power module must be realized through parallel connection of multiple chips. When multiple chips are connected in parallel, the failure of one chip will lead to the scrapping of the entire module, which wastes a huge cost. The controller is One of the core components of the electric system, the power module is the core component of the controller. Since the voltage and current of the power module required by different systems are different, the power module packaged in plastic packaging is used. By combining different numbers of high-power multi-die packaging structural modules, The required voltage and current quotas can be easily achieved. Contents of the invention [0003] In order to solve the...
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Login to View More IPC IPC(8): H01L25/07H01L23/31H01L23/495
CPCH01L25/072H01L23/3121H01L23/49517H01L2224/40137H01L2224/48227H01L2224/0603H01L2224/73221
Inventor 张正义张海泉王晓宝赵善麒
Owner MACMIC SCIENCE & TECHNOLOGY CO LTD