Liquid cooling data center cabinet

Abstract

The invention discloses a liquid cooling data center cabinet, and relates to the technical field of server hardware equipment. The cabinet comprises a square box body with an open upper end. A plurality of coamings are arranged in the square box body; an enclosing plate and the square box body jointly form at least one middle partition plate box with an opening in the upper end; a power distribution module and a network module are placed in the middle partition plate box, and a server vertically inserted into the square box body is fixedly arranged at the position, located outside the middle partition plate box, in the square box body. A stirring device is arranged in the square box body and located below the middle partition plate box, the stirring device comprises an installation plate,wherein the installation plate is provided with a stirring impeller and a receding hole used for containing the server. A liquid return pipe and a liquid supply pipe are respectively arranged on the upper side and the lower side of the stirring device on the square box body. The cabinet has the characteristics of high heat exchange coefficient and high heat exchange capability and the characteristic of uniform heat dissipation of overall parts of the server.

Description

technical field [0001] The invention relates to the technical field of server hardware equipment, in particular to a liquid-cooled data center cabinet. Background technique [0002] With the acceleration of technological innovation in my country's data center industry, the localization level of data centers and servers has been continuously improved, and more and more products have emerged. According to Moore's Law, the power consumption of server chips is increasing year by year. In the next two years, the power consumption of CPU chips will exceed 300W, and the power consumption of GPU chips will exceed 500W. Excessive chip power consumption leads to the use of air-cooled cooling methods, and it is difficult to completely dissipate the heat of the chip, which is easy to generate local hot spots, causing the server chip temperature to be too high, causing downtime and other hazards. Therefore, new cooling methods for servers and chips have become an important research topi...

AI Technical Summary

Problems solved by technology

The commonality of the two methods is that the liquid covers the entire server, the heat transfer is uniform, and the function of the server fan is completely omitted, which is more energy-saving. However, the liquid flows through the server at a slower rate and the convective heat transfer coefficient is small. For areas with high power density such as chips, heat transfer is difficult. Limited capacity, still prone to local hotspots

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