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Ultra-high-speed surface mounting method and surface mounting head

An ultra-high-speed, placement head technology, applied in electrical components, electrical components, etc., can solve the problems of low efficiency, low cost performance, and high production cost of placement machines, to improve placement speed, improve accuracy, and simple steps Effect

Active Publication Date: 2020-06-26
方强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to break through the speed bottleneck of the placement machine, the current main placement method has cumbersome steps and low efficiency, which makes the production cost of the placement machine more and more high, and the cost performance is not high.

Method used

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  • Ultra-high-speed surface mounting method and surface mounting head
  • Ultra-high-speed surface mounting method and surface mounting head
  • Ultra-high-speed surface mounting method and surface mounting head

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specific Embodiment approach

[0114] For the above method, for ease of understanding, steps A to C of the placement method can be collectively referred to as the suction method, and steps D to G can be collectively referred to as the placement method, and as an example, it is assumed that 4 sets of grabbing components are set (A row of sub-grabbing assemblies arranged in the same direction along the direction of the shaft center line of the horizontal turret assembly is a group), each group of grabbing assemblies has 4 sub-grabbing assemblies, that is, n=4, m =4. Each sub-grabbing assembly has a suction nozzle for picking up components, so there are 12 sub-grabbing assemblies and suction nozzles in total. Taking this as an example, the specific implementation of the ultra-high-speed patch method of the present application is as follows:

[0115] Such as figure 2 As shown, the steps A to C collectively referred to as the suction method are complete and detailed as follows:

[0116] a. Start the placement...

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Abstract

The invention discloses an ultra-high-speed chip mounting method and a chip mounting head. The chip mounting head comprises a grabbing assembly. The chip mounting method comprises the following steps:step A, rotating the grabbing assembly to a vertical direction; b, the grabbing assemblies are moved to the corresponding material suction positions, and the corresponding feeders are pushed away; c,the grabbing assembly is pressed downwards to complete material suction, and the feeder is closed; d, the grabbing assembly is rotated to the vertical direction; e, the grabbing assembly is moved tothe corresponding patch position; f, the chip mounting angle of the grabbing assembly is adjusted; and G, the grabbing assembly is pressed down to complete chip mounting. The chip mounting method is simple in step, the chip mounting angle of the grabbing assembly can be adjusted, the chip mounting accuracy is improved, and the chip mounting speed of equipment such as a chip mounter is greatly increased.

Description

technical field [0001] The application relates to the field of automation equipment, in particular to an ultra-high-speed placement method and a placement head. Background technique [0002] The placement machine plays a very important role in the manufacturing process of circuit board packaging. It is the largest investment and the most advanced technology in the production equipment of contemporary mainstream electronic assembly technology. It has the greatest impact on the production capacity and production efficiency of the SMT (Surface Mounted Technology) production line. device of. In fact, the most faults and speed bottlenecks largely come from the placement process, so the development of placement machine equipment is the most eye-catching. [0003] In order to break through the speed bottleneck of the placement machine, the current main placement method has cumbersome steps and low efficiency, which makes the production cost of the placement machine higher and high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
CPCH05K13/0404H05K13/0406
Inventor 方强
Owner 方强
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