Method for manufacturing stepped groove for burying capacitor in PCB by using PCB shape processing machine

Abstract

The invention discloses a method for manufacturing a stepped groove for burying a capacitor in a PCB by using a PCB shape processing machine. The method comprises the following steps: firstly, respectively placing a plurality of base plates with the thickness the same as the processing precision required by a stepped groove to be processed on a working table surface under each main shaft of the PCB shape processing machine; placing a test board with the same thickness as the PCB to be subjected to stepped groove processing on the base plate on the uppermost layer of each working table; settingthe descending distance of drilling tools of the main shafts, and then starting the plurality of main shafts to simultaneously process the stepped grooves in the corresponding test boards; taking down the processed test boards, and increasing or decreasing the base plates; and finally, machining the PCB according to the set descending distance of the drilling tools. The required precision can beachieved after the machining precision of the drilling tool on each main shaft is adjusted through the base plates arranged below in advance, operation is easy, multiple main shafts can work at the same time, the working efficiency is improved, and meanwhile, the product quality is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for manufacturing stepped grooves for embedding PCBs with a PCB shape processing machine. Background technique [0002] With the rapid development of the electronic information industry and the continuous updating of light, thin, high-performance portable electronic products, the PCB as the support of electronic components is also becoming more and more high-density, multi-layered and miniaturized. This requires passive devices that occupy a large surface area to be embedded inside the PCB, which gives birth to embedded resistors, capacitors, inductors and other production process technologies. [0003] Judging from the manufacturing situation of discrete components in the world today, the output has reached 700-900 billion pieces, and the chip rate of passive devices in major developed countries has exceeded 80%, forming a large industrial scale. Amo...

AI Technical Summary

Problems solved by technology

At present, PCB shape processing machines mainly include two-axis, four-axis and six-axis. However, with the improvement of PCB processing precision, the current PCB shape processing machines can no longer reach the required accuracy. In order to improve processing accuracy, many manufacturers only use One axis of the multi-axis machine is processed, which causes waste of cost and reduction of efficiency

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