Three-dimensional elliptical vibration flexible device based on metal porous material

Abstract

The invention relates to a three-dimensional elliptical vibration flexible device based on a metal porous material, and belongs to the technical field of optical part machining. The device is characterized in that a cutter is fixed in a cutter groove in the middle of a T-shaped cutter holder of a flexible base body through a bolt; the heads of piezoelectric stacks in the vertical direction are incontact with straight plate type flexible hinges, pre-tightening blocks are tightened through bolts to pre-tightening the lower ends of the piezoelectric stacks, and capacitive displacement sensors are clamped on sensor clamps; the heads of piezoelectric stacks in the horizontal direction are in contact with straight plate type flexible hinges, and capacitive displacement sensors are clamped on sensor clamps; and the lower portion of a base is connected with dovetail strips through bolts. The device has the advantages that the flexible base body can effectively reduce vibration conducted to amachine tool guide rail from a tool nose, the motion precision of the device is guaranteed, the self-lubricating effect of a mechanism is achieved, the service life is prolonged, and cutting machiningon various face types can be achieved; and meanwhile, the four piezoelectric stacks are provided with the capacitive displacement sensors for monitoring actual displacement in real time and feeding back the actual displacement to a controller for compensation, so that the machining precision is high.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision cutting and complex optical parts processing of difficult-to-machine materials, and in particular relates to a three-dimensional elliptical vibration flexible device based on metal porous materials. Background technique [0002] Brittle and hard materials have been widely used in the manufacture of complex optical precision parts such as optical system lenses and wafers in the semiconductor industry in recent years because of their good contact rigidity, stability, and optical properties. There are many technical problems in the process of processing, which are difficult to achieve with traditional processing methods, and the accuracy is difficult to guarantee. [0003] In order to solve the above problems, elliptical vibration cutting technology came into being. It has many unique processing advantages, mainly including: increasing the life of diamond tools in ferrous metal cutting, grea...

AI Technical Summary

Problems solved by technology

[0007] The invention provides a three-dimensional elliptical vibration flexible device based on metal porous materials to solve the problem that the existing three-dimensional elliptical vibration cutting technology still has kinematic coupling and the vibration of the cutting device is easily transmitted to the guide rail of the machine tool and affects the motion accuracy. Ultra-precision machining of brittle and hard materials

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