Novel testing system and method for photonic integrated chip
A photonic integration and testing system technology, applied in electronic circuit testing, testing optical performance, measuring electricity, etc., can solve the problems of expensive equipment, fixed functions, and inability to flexibly apply, and achieve the effect of convenient and fast installation and low cost.
Pending Publication Date: 2020-07-14
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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[0002] With the acceleration of the global informatization process, the rapid development of microelectronics technology has been promoted. At the same time, optoelectronics and photonic integration technology have also developed. Among them, silicon-based photonic integration technology is extremely important. Silicon-based photonic integrated chips are an important part of photonic integration technology. The development direction plays a great role in the field of optical fiber communication. At present, the test for silicon-based photonic integrated chips is mainly for high-throughput testing. The equipment is expensive, the function is fixed, and it cannot be flexibly applied.
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other component or t...
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The invention relates to the technical field of photonic integrated chip testing, and discloses a novel testing system and method for a photonic integrated chip. The system comprises a testing deviceand an integrated chip placing device, wherein the testing device comprises one or two of an electric coupling testing device and an optical coupling testing device; the electric coupling testing device and the optical coupling testing device are detachably installed around the integrated chip placing mechanism; the electric coupling testing device comprises a single-probe coupling module and a probe card coupling module; and the optical coupling testing device comprises an array optical fiber coupling module and an optical fiber coupling module. By improving the structure, the electric coupling testing mechanism and the optical coupling testing device are formed, the optical coupling test and the electric coupling test can be flexibly carried out on the to-be-tested integrated chip by matching and assembling, the installation is convenient and fast, and the cost is low.
Description
technical field [0001] The invention relates to the technical field of photonic integrated chip testing, in particular to a novel testing system and method for photonic integrated chips. Background technique [0002] With the acceleration of the global informatization process, the rapid development of microelectronics technology has been promoted. At the same time, optoelectronics and photonic integration technology have also developed. Among them, silicon-based photonic integration technology is extremely important. Silicon-based photonic integrated chips are an important part of photonic integration technology. The development direction plays a great role in the field of optical fiber communication. At present, the test for silicon-based photonic integrated chips is mainly for high-throughput testing. The equipment is expensive, the function is fixed, and it cannot be flexibly applied. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the ob...
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IPC IPC(8): G01R31/28G01M11/02
CPCG01M11/02G01R31/2851
Inventor 李静婷赵复生赵俊洋
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI