A high temperature shear test fixture for semiconductor chips

A shear test and semiconductor technology, applied in the direction of applying stable shear force to test the strength of materials, instruments, measuring devices, etc., can solve the problems that cannot meet the requirements of the chip shear test of surface mount components, and achieve easy replacement and heating The effect of fast speed and preventing uneven force

Active Publication Date: 2021-10-08
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing shear fixtures cannot meet the shear test requirements of surface mount component chips

Method used

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  • A high temperature shear test fixture for semiconductor chips
  • A high temperature shear test fixture for semiconductor chips

Examples

Experimental program
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Embodiment Construction

[0019] In order to further understand the content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:

[0020] like figure 1 and figure 2 As shown, this embodiment provides a semiconductor chip high-temperature shear test fixture. The fixture is made of 4Cr13 high-temperature resistant material as a whole, and is composed of a connecting unit, a temperature loading unit and a force applying unit. The connection unit includes a first clamp connector 1 and a second clamp connector 8; the temperature loading unit includes a substrate fixing block 2, a ceramic heating rod 10, a wire 11 and a cover plate 12; the force applying unit includes a rubber strip 6 and a push head 7.

[0021] One end of the first clamp connector 1 is fixed to the load sensor of the output actuator by fastening screws, and the other end is connected to the substrate fixing block 2 ....

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PUM

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Abstract

The invention belongs to the field of shear strength test, and discloses a fixture for high temperature shear test of semiconductor chips, comprising a first fixture connector and a second fixture connector connected to an output actuating mechanism, the first fixture connector is connected to a substrate for fixing block, the second fixture connector is connected with a push head; the surface of the substrate fixing block is used to fix and install the substrate, and a semiconductor chip is attached to the surface of the substrate; a ceramic heating rod is arranged inside the substrate fixing block, and the ceramic heating rod is connected to an external temperature control box; The head is used to apply force to the semiconductor chip. The force end face of the push head is perpendicular to the substrate, the lower surface is parallel to the substrate, and the upper surface is a slope transition from the force end face to the end of the push head from bottom to top; the force application of the push head Glue strips are fixed on the end faces, and the glue strips are used for contacting the semiconductor chips. The invention can make the semiconductor chip be loaded by force-thermal coupling, precisely control the temperature, apply force uniformly, and ensure the reliability of the test.

Description

technical field [0001] The invention belongs to the field of shear strength test, and in particular relates to a shear strength test fixture used for semiconductor chips. Background technique [0002] For the installation quality of surface mount components, it can be carried out by three methods: welding visual inspection, shear force and metallographic section grinding. Among them, the shear strength test of the semiconductor chip is to use the measurement of the shear force applied to the chip and the observation of the failure type to determine the quality of the substrate on which the chip is attached. [0003] In order to comply with the requirements of the method 2019.2 chip shear strength for chip contact tools in GJB548B-2005 "Test Methods and Procedures for Microelectronic Devices", the fixture in the test must ensure that the force is evenly applied to one edge of the chip, and at the same time the fixture is in contact with the chip The plane of is perpendicular...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/04G01N3/24
CPCG01N3/04G01N3/24G01N2203/0025G01N2203/0226G01N2203/0429
Inventor 陈刚林强
Owner TIANJIN UNIV
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