A high temperature shear test fixture for semiconductor chips
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TIANJIN UNIV
- Publication Date
- 2021-10-08
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Abstract
Description
technical field
[0001] The invention belongs to the field of shear strength test, and in particular relates to a shear strength test fixture used for semiconductor chips. Background technique
[0002] For the installation quality of surface mount components, it can be carried out by three methods: welding visual inspection, shear force and metallographic section grinding. Among them, the shear strength test of the semiconductor chip is to use the measurement of the shear force applied to the chip and the observation of the failure type to determine the quality of the substrate on which the chip is attached.
[0003] In order to comply with the requirements of the method 2019.2 chip shear strength for chip contact tools in GJB548B-2005 "Test Methods and Procedures for Microelectronic Devices", the fixture in the test must ensure that the force is evenly applied to one edge of the chip, and at the same time the fixture is in contact with the chip The plane of is perpendicular...