Silicon wafer surface defect visual detection device and detection method

Abstract

The invention discloses a silicon wafer surface defect visual detection device and detection method; the device has the image acquisition card and the motion control card that are respectively connected with the computer; an image acquisition part of the computer is connected with the illumination imaging unit through an image acquisition card; a driving control part of the computer is respectively connected with the silicon wafer bearing platform and the hollow electric rotating platform through a motion control card; the hollow electric rotary table is fixed on the machine table, and connected with the illumination imaging unit through an L-shaped connecting bracket fixed on the hollow electric rotary table; the illumination imaging unit is driven to rotate by taking the central axis ofthe silicon wafer bearing platform as an axis under the control of the computer; the bottom end of the silicon wafer bearing platform sequentially penetrates through the front end of the horizontal part of the L-shaped connecting bracket and a center through hole of the hollow electric rotary table to be fixed to the machine table; the silicon wafer bearing platform is connected with the motion control card, and therefore the silicon wafer to be detected is driven to be finely adjusted under the control of the computer to reach the optimal image taking position. According to the invention, the silicon wafer defect image acquisition speed is effectively improved, and the silicon wafer detection success rate and efficiency are effectively improved.

Description

technical field [0001] The invention relates to the detection of surface defects of a silicon wafer. In particular, it relates to a silicon wafer surface defect visual detection device and detection method for synchronous image acquisition based on a rotating illumination light source and a camera. Background technique [0002] Silicon wafer is an important upstream product for making solar cells and semiconductor devices, and its quality seriously affects the production and work efficiency of subsequent products. In the automatic production process of silicon wafers, the quality inspection of surface defects is an important part. The surface defects of silicon wafers can be divided into holes, chipping, stains, scratches, etc. At present, in most silicon wafer manufacturing enterprises, the quality monitoring of silicon wafers mainly relies on manual visual inspection, which has the advantages of high work intensity, low efficiency, and inspection. Low yield and secondary...

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Problems solved by technology

This method generally cannot accurately obtain complete silicon wafer surface defects

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