Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A heat dissipation structure and technology applied to high-precision blind hole circuit board

A heat dissipation structure and circuit board technology, which is applied in the direction of circuit heat devices, printed circuits, printed circuits, etc., can solve the problems of reduced utilization of components, unfavorable integrated circuit boards, poor heat dissipation, etc., to reduce impact and increase ventilation , The effect of accelerating heat dissipation

Active Publication Date: 2021-03-16
深圳捷飞高电路有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned existing technical solutions have the following defects: the above-mentioned arrangement adopts vertical boards to separate the electrical components on the circuit board, resulting in poor ventilation effect between the electrical components, resulting in poor heat dissipation effect, and the vertical plate installed on the circuit board board, resulting in reduced utilization of the side where components are placed on the circuit board, which is not conducive to the setting of integrated circuit boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A heat dissipation structure and technology applied to high-precision blind hole circuit board
  • A heat dissipation structure and technology applied to high-precision blind hole circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0039] refer to figure 1 and figure 2 , is a heat dissipation structure applied to a high-precision blind hole circuit board disclosed in this embodiment, including a circuit board body 1, a heat dissipation plate 11, a heat dissipation extension plate 12, and a heat conduction column 13, and the heat dissipation plate 11 is arranged on the circuit board body 1 On one side of the circuit board body 1 , the heat conduction column 13 penetrates the circuit board body 1 and connects with the heat dissipation plate 11 .

[0040] The circuit board body 1 includes a first copper foil layer 14 and a second copper foil layer 15, the first copper foil layer 14 and the second copper foil layer 15 are bonded together by a first adhesive layer 16, and the second copper foil layer The foil layer 15 is connected to the heat dissipation plate 11 through the second adhesi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of circuit boards, and in particular relates to a heat dissipation structure applied to a high-precision blind hole circuit board and a process thereof. The circuit board comprises a circuit board body, a heat dissipation plate arranged at one side of the circuit board body, a heat dissipation extension plate arranged at one side of the heat dissipationplate and located at the outer side of the circuit board body, and a heat conduction column arranged at the position, corresponding to a high-heating component, of the circuit board body. The heat conduction column is connected with the heat dissipation plate. An angle is formed between the heat dissipation extension plate and the heat dissipation plate, and the heat dissipation extension plate inclines towards the side away from the circuit board body. According to the invention, the heat dissipation capability of the circuit board is improved, and the influence on the position placement ofelectrical elements on the circuit board is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a heat dissipation structure applied to a high-precision blind hole circuit board and a process thereof. Background technique [0002] With the development of science and technology, the electronic process technology is becoming more and more mature, so that the volume of electronic equipment is gradually reduced, and the electronic components required for electronic equipment are integrated and installed on the circuit board. In order to achieve the purpose of reducing the volume of electronic equipment, installation The distance between electronic and electrical components on the circuit board is usually relatively small, and the electronic and electrical components usually generate heat during operation. If the heat cannot be dissipated in time, the circuit board will be damaged. [0003] Chinese patent announcement number CN209659703U is named as a circuit board with a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0204H05K1/0209H05K1/021H05K2201/10598
Inventor 丰正汉胡涵
Owner 深圳捷飞高电路有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com