Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polishing head, polishing device and polishing equipment

A technology for grinding heads and abrasive parts, applied in grinding/polishing equipment, grinding/polishing safety devices, grinding heads, etc., can solve problems such as poor applicability, complex structure of grinding devices, affecting workpiece grinding efficiency and grinding yield, etc. To achieve the effect of detachable and quick installation, improve grinding efficiency and yield

Active Publication Date: 2020-07-28
SHENZHENSHI YUZHAN PRECISION TECH CO LTD
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional grinding device has a complex structure and poor applicability. For example, most grinding devices are only suitable for arc surface grinding. When the grinding device grinds a plane, the center of the grinding belt is prone to warping, which affects the grinding effect of the center area of ​​the plane, thereby affecting the workpiece. The grinding efficiency and grinding yield rate are high. The grinding head of the traditional grinding device is mostly integrally formed, and it is not easy to quickly replace the grinding belt on the grinding head.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polishing head, polishing device and polishing equipment
  • Polishing head, polishing device and polishing equipment
  • Polishing head, polishing device and polishing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0073] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0074] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a centered component at the same time. When a component is said to be "set on" another component, it can be set directly on another component or there may be a centrally set component at the same time.

[0075] Unless otherwise defined, all technical and scientific terms used her...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a polishing head comprising a polishing body and a connection piece, wherein the polishing body and the connection piece are detachably connected. The connection tightness degree between the connection piece and the polishing body is adjusted, so that the diameter of the polishing body is controlled. By adjusting the connection tightness degree between the connection piece and the polishing body, the diameter of the polishing body is controlled, and then detachable rapid installation of the connection piece and the polishing body is achieved. Meanwhile, a polishing belton the polishing body can be rapidly and conveniently replaced. The polishing head is driven by an external drive device to rotate to polish a workpiece, a polishing point of the polishing head achieves the same polishing effect on the whole polished plane of the workpiece, so that the polishing efficiency and yield of the polishing head are improved. The invention also provides a polishing deviceand polishing equipment.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to a grinding head, a grinding device and grinding equipment. Background technique [0002] The traditional grinding device has a complex structure and poor applicability. For example, most grinding devices are only suitable for arc surface grinding. When the grinding device grinds a plane, the center of the grinding belt is prone to warping, which affects the grinding effect of the center area of ​​the plane, thereby affecting the workpiece. The grinding efficiency and grinding yield rate are high. The grinding head of the traditional grinding device is mostly integrally formed, and it is not easy to quickly replace the grinding belt on the grinding head. Contents of the invention [0003] In view of the above situation, it is necessary to provide a grinding head, a grinding device and a grinding equipment to solve the above problems. [0004] The first aspect of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B24B27/00B24B41/047B24B41/00B24B7/00B24B45/00B24B55/06B24B41/06
CPCB24B27/0084B24B41/047B24B41/007B24B7/00B24B45/003B24B55/06B24B41/06
Inventor 张锋汤爱军张志新黄文超周亮
Owner SHENZHENSHI YUZHAN PRECISION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com