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Radiator with fins capable of being opened and closed in self-adaptive mode along with temperature

A temperature-dependent, self-adaptive technology, used in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc. Dust-proof and anti-collision effect, the effect of prolonging the service life

Pending Publication Date: 2020-07-31
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, provide a heat sink with adaptive opening and closing fins with temperature, and solve the problem that the shape and size of the heat dissipation fins cannot be changed after the assembly is completed

Method used

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  • Radiator with fins capable of being opened and closed in self-adaptive mode along with temperature
  • Radiator with fins capable of being opened and closed in self-adaptive mode along with temperature
  • Radiator with fins capable of being opened and closed in self-adaptive mode along with temperature

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Experimental program
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Embodiment 1

[0030] Such as figure 1 and figure 2 As shown, this embodiment provides a heat sink with fins that expand and close adaptively with temperature, including a base 1 and a heat dissipation assembly.

[0031] Such as figure 1 , figure 2 and image 3 As shown, the bottom surface of the base is provided with a heat source, and the top surface of the base is provided with a plurality of installation slots 2, the installation slots are square, the size is 1mm×25mm×3mm, the distance between the center lines of the two slots is 10mm, and the installation slots are equipped with tin Paste, each mounting slot is provided with a group of heat dissipation components, the distance between two adjacent groups of heat dissipation components is 10mm, the heat dissipation components include shape memory alloy parts 3 and heat dissipation fins 4, and the shape memory alloy parts and heat dissipation fins are both sheet-shaped , the size of the heat dissipation fin is 25mm×60mm, the size of...

Embodiment 2

[0035] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that the heat sink with self-adaptive opening and closing fins with temperature also includes a plurality of clamping parts 5 and limiting parts 6, and the clamping parts are placed on the base On the top surface, two adjacent clamping parts jointly clamp the root of the shape memory alloy part and the root of the cooling fin. The limiting part is U-shaped, and the limiting part includes a connecting rod 61 and a fixing rod 62. The two ends of the connecting rod They are respectively connected to the fixed rods, the connecting rods are crimped to the top surfaces of multiple clamping parts from top to bottom, the fixed rods are fixed to the end face of the base through bolts 7, and the length of the base along the axial direction is the same as that of the multiple clamping parts along the axis. The lengths arranged in the same direction are equal to the lengths of the connecting rods...

Embodiment 3

[0037] Such as Figure 5 and Figure 6 As shown, the difference between this embodiment and Embodiment 1 is that the heat dissipation fins and shape memory alloy parts are respectively folded in half along the middle, and the head and tail ends of the heat dissipation fins and shape memory alloy parts are respectively fixed in the installation grooves, and the shape memory The alloy parts are located inside the cooling fins. After folding the cooling fins and shape memory alloy parts in half, the upper and lower parts folded in half are attached at low temperature. As the temperature rises, the shape memory alloy parts inside the cooling fins begin to deform, and the cooling fins are gradually opened. Increase the contact area between the cooling fins and the air. At the same time, compared with the case where the cooling fins and the shape memory alloy parts are not folded in half, the heat dissipation area of ​​the cooling fins after folding is increased by one when the ini...

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Abstract

The invention discloses a radiator with fins capable of being opened and closed in a self-adaptive mode along with temperature. The radiator comprises a base and a heat dissipation assembly, wherein aplurality of mounting grooves are formed in the base, each mounting groove is internally provided with a set of heat dissipation assembly, each heat dissipation assembly comprises a shape memory alloy sheet and a heat dissipation fin, the shape memory alloy sheets are tightly attached to the heat dissipation fins, the roots of the shape memory alloy sheets and the roots of the heat dissipation fins are jointly fixed into the mounting grooves, and the shape memory alloy sheet deforms along with temperature change to drive the heat dissipation fin to move. According to the invention, a heat source is arranged on the bottom face of the base, the base absorbs the heat of the heat source and starts to be heated, the shape memory alloy sheet deforms into a shape corresponding to the temperaturealong with the temperature rise, and the shape memory alloy sheet drives the heat dissipation fin to be gradually unfolded along with the temperature rise; and compared with the traditional straightfin radiator, the radiator of the invention has the following characteristics that the opening and closing angles of the heat dissipation fins can be changed along with the temperature, and the posture of the radiator is automatically adjusted according to the heat dissipation requirements at different moments so as to meet the heat dissipation requirements.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a heat sink with fins that expand and close adaptively with temperature. Background technique [0002] In recent years, with the continuous innovation of science and technology, electronic devices have gradually developed towards integration, high power density and miniaturization, which has led to increasing power dissipation per unit area of ​​electronic devices and increasing surface heat flux. High-end chips in the technology industry even reach 500W / cm 2 about. Studies have shown that more than 55% of electronic equipment failures are caused by operating temperatures exceeding the limit, and extreme temperatures can also lead to a decrease in the service life of electronic devices. If the operating temperature of an electronic device exceeds the limit by 10°C, its reliability will be reduced by about 50%. [0003] Finned radiators are one of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20418
Inventor 丁鑫锐刘嘉祺汤勇李宗涛余彬海
Owner SOUTH CHINA UNIV OF TECH
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