A Preparation Technology of Optical Ring Die with Restriction of Hole Retraction
A preparation process and ring die technology, which is applied in the field of hole shrinkage-restraining light-type ring die preparation process, can solve the problems of roundness damage, poor ring die use effect, and increased defective rate, so as to ensure the shaping effect , strong self-bearing capacity, and the effect of maintaining stability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0052] A preparation process of an optical ring die with suppressed hole retraction, comprising the following steps:
[0053] S1. First, select the appropriate ring die semi-finished product according to the required ring die specifications;
[0054] S2. Drill the semi-finished product of the ring die through an eight-station CNC deep hole gun drill to obtain a die hole;
[0055] S3. According to the required aperture requirements, use a reaming machine to ream the die hole to obtain a ring die with a die hole;
[0056] S4. Remove the debris on the ring die after drilling and reaming, see figure 1 , and gently extrude the embedded shrink-controlled mass from the inside of the ring die into the die hole until the embedded shrink-controlled mass passes through the die hole on the ring die and extends to the outside of the ring die, and is completely wrapped inside and outside the ring die ;
[0057] S5. Use the inner pneumatic shaping column to shape the part of the embedded ...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com