Patents

Literature

Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

5 results about "Die preparation" patented technology

Filter

Efficacy Topic

Property

Owner

Technical Advancement

Application Domain

Technology Topic

Technology Field Word

Patent Country/Region

Patent Type

Patent Status

Application Year

Inventor

Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.