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13 results about "Die preparation" patented technology

Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.

A three-in-one forming mold based on pet food preparation

ActiveCN117882873BFeeding-stuffMechanical engineeringDie preparation
The present application relates to the technical field of pet food preparation, and discloses a three-in-one forming die based on pet food preparation, the front and back sides of the second die are symmetrically provided with locking assemblies, the bottom end of the arm rod of the locking swing arm A is provided with a locking hook A which is locked with the locking assembly, and the bottom end of the arm rod of the locking swing arm B is provided with a locking hook B which is locked with the locking assembly. The present application replaces the traditional single-die preparation mode of pet food, and through the integrated step-by-step assembly of the first die mechanism, the second die mechanism and the third die mechanism, and through the locking and tightening positioning of the locking assemblies on the second die mechanism combined with the locking swing arms and the locking hooks on the first die mechanism and the third die mechanism, the three independent die mechanisms can be integrally assembled and fixed to form a three-in-one pet food preparation die, and the pet food raw materials can be stacked and laid flat.
Owner:QINGDAO MINGYUE ANXIN NUTRITION TECH CO LTD

Preparation method of bearing part hot stamping die

The invention provides a preparation method of a bearing part hot stamping die. Belongs to the technical field of bearing part stamping die preparation, and particularly relates to an innovative composite surface hardening treatment method for M50 steel with good adaptability to a bearing part material as a die base body. The composite surface hardening treatment method comprises the following two key steps: firstly, carrying out pressure stress nitriding treatment on an M50 steel substrate to form a supporting layer which is high in hardness and bearing capacity and can enhance the film-substrate binding force; then, on the nitriding layer, a TiN nanocrystalline / a-SiN amorphous alternate nanometer multilayer composite coating is prepared through a reactive magnetron sputtering vacuum physical vapor deposition technology, and the composite coating is high in surface hardness and good in overall toughness and has a self-lubricating effect; the wear resistance, thermal stability, coating adhesion and impact toughness of the bearing part hot stamping die are remarkably improved, and the service life of the bearing part hot stamping die is prolonged.
Owner:AVIC BEIJING INST OF AERONAUTICAL MATERIALS

Preparation method of power blade invar alloy forming mold and forming mold

The invention discloses a power blade invar alloy forming mold preparation method and a forming mold, the forming mold comprises a suction surface forming mold, and the suction surface forming mold preparation method comprises the steps that invar alloy is adopted to prepare a main body frame of the suction surface forming mold; invar alloy is adopted as a skin panel, and the skin panel is heated and then pressurized and shaped; the shaped skin panel is welded with the main body frame; and the welded blank body is subjected to heat treatment to eliminate internal stress generated in the welding process. An invar alloy metal plate is adopted for shaping, a molded surface and a back frame are welded and formed, the size of the invar alloy is kept stable in a high-temperature environment due to the low thermal expansion coefficient of invar alloy, and the manufacturing method is particularly suitable for manufacturing large power blades. After welding is completed, internal stress generated in the welding process is eliminated through heat treatment, the overall strength and stability of the die are enhanced, the service life is prolonged, the reliability is improved, the power blade bearing high loads is not prone to deformation during forming, and the product quality is improved.
Owner:ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO LTD +1

Preparation method of microfluidic chip and forming die

The present application belongs to the technical field of microfluidic chip preparation, and particularly relates to a microfluidic chip preparation method and a forming die. The microfluidic chip preparation method comprises the following steps: die preparation, preparation of a forming die, the forming die comprising: compensation gaskets, a concave die, and a convex die, at least two compensation gaskets are prepared, the thicknesses of the compensation gaskets are different, a containing through slot is formed on the concave die, and the concave die is fixedly arranged, the shape of the containing through slot is matched with the shape of the convex die; compensation, one of the compensation gaskets is arranged on one side of the concave die and below the containing through slot; the convex die is partially inserted into the containing through slot on the other side of the concave die and abuts against the compensation gasket; die pressing, a blank is placed on the exposed end of the convex die, and pressure is applied on the blank, so that the convex die processes a microfluid channel on the blank. The present application can improve the demolding convenience of the microfluidic chip and improve the die pressing precision.
Owner:SHENZHEN UNIV

Architecture for optimizing a boot-up process of an integrated

An integrated circuit device includes a plurality of chiplets. The first chiplet is configured to execute a first boot sequence to prepare the first chiplet for operation and output a trigger signal. The second chiplet is configured to perform a second boot sequence in response to the trigger signal to prepare the second chiplet for operation. The first boot sequence at least partially overlaps the second boot sequence in time. An example of an integrated circuit device is a system-on-chip (SoC) that may include various subsystems distributed in a plurality of chiplets or dies. The boot sequences of the subsystems are ranked to increase concurrency between the boot sequences. The concurrency of startup sequences among the chiplets is increased, and the overall startup time of the SoC is reduced.
Owner:QUALCOMM INC

A reusable gypsum forming mold based on a numerical control machine tool and a preparation method thereof

The application discloses a reusable gypsum forming die based on a numerical control machine tool and a preparation method thereof, and relates to the technical field of building decoration material manufacturing. The method comprises the steps of die preparation, slurry preparation, gradient pouring, curing and demolding. A preset product profile is formed by driving an adjustable die core system of the numerical control machine tool, and a plastic isolation film is laid. Surface layer and bottom layer gypsum slurries containing specific components are respectively prepared. The surface layer slurry focuses on wear resistance and water resistance, and the bottom layer slurry focuses on toughness and light weight. The surface layer and the bottom layer are sequentially poured to form the surface layer and the bottom layer. The bottom layer pouring is completed before the initial setting of the surface layer to realize stable and firm combination of the interface. After being segmented and dried to a constant weight, the die is demolded. A long-acting demolding agent is coated on the working surface. The die is an integrally-formed gradient functional structure. Through the collaborative design of the material system and the forming process, the reuse performance and the forming precision of the die are significantly improved. The die is suitable for the batch efficient production of building decoration special-shaped components and has good practicability and economy.
Owner:GUANGDONG GUOWEI BUILDING MATERIALS TECH CO LTD

A method for preparing a high-strength, impact-resistant cold heading die

The present application relates to the technical field of alloy, in particular to a high-strength, impact-resistant hard alloy cold heading die preparation method. It aims to improve the anti-chipping and anti-radial cracking ability of the die lip and the working zone under high impact cold heading conditions. The die includes an outer working zone surrounding the die cavity and located in the corresponding area of the lip and the working zone, and a core bearing zone located outside the outer working zone, both of which are sintered integrally. The outer working zone adopts a tungsten carbide nano / micro powder compound system, through two-stage cobalt-containing precursor coating, and introduces ionic cerium source and particulate cerium source at different solid contents in sections, and adjusts the grain and binder phase distribution with vanadium carbide; the core bearing zone adopts a tungsten carbide micro powder-cobalt powder system. The die is prepared by partitioning die pressing, dewaxing, liquid phase sintering and argon pressure sintering, and is suitable for high load and high frequency cold heading forming.
Owner:ZHUZHOU HONGTONG CEMENTED CARBIDE

A method of autoclave forming a large-curvature variable-thickness trailing edge strip

The application discloses a hot press tank forming method of a large-curvature variable-thickness trailing edge strip, and comprises the following steps: raw material preparation; forming male die preparation; blanking of pre-impregnated material strips with different sizes; pre-impregnated material is laid on the laying surface of the forming male die according to a laying design, and the laying direction is from the large-end end to the small-end end, and the laying thickness gradually decreases; a vacuum system is arranged; the forming male die is transferred into a hot press tank to perform pre-compaction; a lateral baffle is installed on the forming male die, a release agent is applied to the contact surface of the lateral baffle and the pre-impregnated material blank, and a vacuum system is arranged; the forming male die is transferred into the hot press tank to perform final solidification; and demolding is performed; the large-curvature variable-thickness trailing edge strip can be prepared by using the application, and the preparation cost is low, and a complex die structure is not needed.
Owner:JIANGSU XINYANG NEW MATERIALS CO LTD

Method for forging a spherical shell without flash

PendingCN122625573ALubricantStress sensors
The application discloses a spherical shell flash-free forging forming method, which comprises the following steps: S1, composite die preparation and debugging: a double closed loop cavity die of a main cavity and a shunt pressure relief auxiliary cavity is adopted, the size tolerance of the main cavity is ±0.05mm, the auxiliary cavity is communicated with the main cavity through a 0.2mm-0.4mm flow limiting channel, an annular composite groove structure is arranged on the inner wall of the die cavity, the annular composite groove comprises a macro groove and a micro groove, an elastic core die is arranged in the die cavity, the elastic core die is composed of a rigid inner core and an optim glue elastic outer layer, the error of a pressure sensor in debugging is ≤±2MPa, a closed loop seal is arranged on a parting surface, the die cavity is polished to Ra≤0.05μm and is sprayed with a high-temperature lubricant; S2, metal blank conditioning pretreatment: a matched material blank is selected, the diameter is 1.1-1.2 times of a target spherical shell and the thickness is 1.3-1.5 times of the target spherical shell. The double closed loop cavity and the shunt pressure relief structure are adopted, the flash is completely eliminated, the trimming process is omitted, the material utilization rate is improved from 70%-90% to 95%-97%, the residual material of the auxiliary cavity can be recycled, and the production process is effectively simplified.
Owner:XUANCHENG LONGHU PRECISION TECH CO LTD

Integral forging and pressing forming method for metal product and die mechanism

The invention relates to the technical field of metal manufacturing, and discloses an integral forging and pressing forming method of a metal product and a mold mechanism, the method comprises the following steps: S1, pretreating a titanium outer frame: processing the titanium outer frame to enable the roughness of the inner wall of the outer frame to reach 100-250 microns; s2, mold preparation: spraying a release agent to the cavity wall of the forging and pressing forming mold; according to the invention, the limitation of simple characteristics of forged and molded products is broken through, and the problems of long technological process, large tool abrasion loss, difficult material processing, long processing time, large resource occupation, high comprehensive cost and the like are solved; according to the process method and the mold mechanism, more complex and changeable structural characteristics in a product can be formed, when the mold mechanism is used, the first spring in the ejection assembly can be protected, the service life of the first spring is prolonged, and therefore the service life of the mold mechanism is prolonged.
Owner:GUANGZHOU FUJIN PRECISION TECH CO LTD

An all-glass passivated diode and a method for producing the same

This invention provides a method for producing all-glass passivated diodes, comprising the following steps: (I) Preparation: (a) Chip preparation; (b) Raw material preparation; (c) Software preparation: Presetting laser parameters and raw material parameters, using computer-aided design (CAD) technology with computer modeling software to complete the preset information for laser sintering according to different diode design requirements, and transmitting the preset information to the semiconductor laser; (II) Uniform powder spreading; (III) Laser sintering; (IV) Recycling; (V) Removal of adhesive residue. The all-glass passivated diode production method of this invention uses laser forming technology to prepare the glass seal of the diode PN junction, precisely controls the diode glass sintering, completes the full seal of the diode PN junction in a single step, and eliminates potential sources of failure. This invention also provides an all-glass passivated diode produced using the aforementioned all-glass passivated diode production method.
Owner:FOSHAN YOUKUANG SEMICON TECH CO LTD

Preparation process of diamond wire-drawing die

The invention belongs to the technical field of metal material forming and manufacturing, and particularly relates to a preparation process of a diamond wire-drawing die. The preparation process of the diamond wire-drawing die comprises the steps of powder preparation, base powder pre-pressing, diamond inlaying, flour pre-pressing, sintering and the like. By improving the powder raw material ratio and the preparation process, the strength after sintering is obviously enhanced compared with that in the prior art, the hardness HRC of the powder can reach 65-70, and the binding force, wrapping force and the like of the powder are remarkably improved, so that the impact resistance of a metal wire drawing die manufactured from the powder is enhanced, and the service life of the metal wire drawing die is prolonged. Cracking and bursting caused by insufficient strength of a sintered filler mixture and the like of the metal wire drawing die in the hard wire drawing process can be effectively avoided, the service life of the metal wire drawing die is greatly prolonged, meanwhile, the sintering speed is effectively increased, and the yield is increased.
Owner:河南中南工业有限责任公司