A modified assembly line for rubber pad back glue processing

Abstract

The invention relates to a refit assembly line for rubber pad back glue processing, and relates to the technical field of rubber pad production equipment, which includes a gluing mechanism, which is used to apply glue on a rubber strip to form a bonding layer; an unwinding mechanism , the unwinding mechanism is used to unwind the release film; the pressing mechanism, the pressing mechanism is used to press the release film on the adhesive layer to form a release layer; the cutting mechanism, the cutting mechanism is used to apply the back glue The processed rubber strips are cut into multiple pieces of rubber pads; it also includes a conveyor, a gluing mechanism, an unwinding mechanism, a pressing mechanism and a cutting mechanism that are suspended above the conveying surface of the conveyor, and the gluing mechanism, unwinding mechanism 1. The left and right ends of the pressing mechanism and the cutting mechanism are connected to the two ends of the conveyor; the invention has the effects of low cost and simple structure.

Description

technical field [0001] The invention relates to the technical field of rubber pad production equipment, in particular to a refit assembly line for rubber pad back glue processing. Background technique [0002] In the prior art, in order to ensure the installation safety of equipment such as solar panels, rubber pads are generally installed on each side or end corner of the bottom of such equipment. Therefore, the use of rubber pads for equipment is of great significance; in the prior art, there are two types of rubber pads, one is installed on the equipment before the equipment is installed, and the other is It is only installed on the equipment when the equipment is installed and used. No matter which type, in order to ensure the safe use of the rubber pad, it is generally necessary to set one side of the rubber pad with adhesive, so that the rubber pad can be bonded to the equipment. superior. [0003] Existing technology discloses a kind of rubber self-adhesive sealing ...

AI Technical Summary

Problems solved by technology

[0006] As mentioned above in the prior art, the back glue generally includes an adhesive layer bonded on the rubber pad and a release layer arranged on the adhesive layer. During use, the release layer is torn off, and then the adhesive layer is used to The rubber pad can be adhered to the equipment; in the prior art, the adhesive system is generally used to process the adhesive on the rubber strip, and a bonding layer is formed on the rubber strip by coating, bonding, etc., and then unwinding and The pressing mechanism fits on the adhesive layer to bond the release layer, and finally use the cutting mechanism to cut; however, in the existing adhesive processing, it is necessary to use multiple pinch mechanisms fixed on the platform frame Cooperate with the pressing mechanism to convey rubber strips. In order to avoid tensile stress on the rubber strips caused by different feeding mechanisms and pressing mechanisms, motors need to be installed on each feeding mechanism and pressing mechanism to control the conveying speed, and each motor How to precisely control, error correction and other issues belong to the technical problems of system control, which lead to a large cost of the assembly line of adhesive processing, and at the same time cause the structure of the assembly line of adhesive processing to be too complicated, so it needs to be improved

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