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Conductive silver paste, conductive circuit, circuit board, terminal and preparation method of conductive silver paste

A technology of conductive silver paste and conductive circuit, which is applied in the field of conductive silver paste, conductive circuit, terminal and conductive silver paste preparation, and circuit board, which can solve the problems of silver plating migration and other problems, so as to avoid migration, silver ionization and The migration and inhibition effect of hydroxide ion is remarkable

Active Publication Date: 2020-08-07
ANHUI JINGZHUO OPTICAL DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after long-term use of terminals containing silver, silver plating, silver solder, or silver used as electrodes will migrate

Method used

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  • Conductive silver paste, conductive circuit, circuit board, terminal and preparation method of conductive silver paste
  • Conductive silver paste, conductive circuit, circuit board, terminal and preparation method of conductive silver paste
  • Conductive silver paste, conductive circuit, circuit board, terminal and preparation method of conductive silver paste

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0085] Specific embodiment one: see Figure 5 A method of silver migration in a test conductive silver paste may further comprise the steps:

[0086] S202, select 100 g of silver paste base material and place it in a beaker. The silver paste base material is the silver paste of model LOCTITE ECI 5004E&C produced by Henkel Company, and the content of silver in the silver paste base material is about 65%.

[0087] S204, add 2 g of glacial acetic acid to the beaker, and mechanically stir for 15 minutes to mix the organic acid and the silver paste base material evenly, and then prepare the conductive silver paste. Glacial acetic acid is anhydrous acetic acid.

[0088]After the conductive silver paste that this embodiment makes is tested through above-mentioned test method, the surface appearance of test piece is as follows: Figure 6 shown. After the conductive silver paste without adding organic acid is tested by the above test method, the surface morphology of the test mater...

specific Embodiment 2

[0089] Specific embodiment two: see Figure 7 A method of silver migration in a test conductive silver paste may further comprise the steps:

[0090] S302, select 100 g of silver paste base material and place it in a beaker. The silver paste base material is the silver paste of model LOCTITE ECI 5004E&C produced by Henkel Company, and the content of silver in the silver paste base material is about 65%.

[0091] S304, add 4 g of glacial acetic acid to the beaker, and mechanically stir for 15 minutes to mix the organic acid and the silver paste base material evenly, and then prepare the conductive silver paste.

[0092] After the conductive silver paste that this embodiment makes is tested through above-mentioned test method, the surface appearance of test piece is as follows: Figure 8 shown. see Figure 8 , there is no flocculent or dendritic pattern around the conductive line Figure 4 It is obvious that the silver migration phenomenon of the conductive silver paste is ...

specific Embodiment 3

[0093] Specific embodiment three: see Figure 9 A method of silver migration in a test conductive silver paste may further comprise the steps:

[0094] S402, select 100 g of silver paste base material and place it in a beaker. The silver paste base material is the silver paste of model LOCTITE ECI 5004E&C produced by Henkel Company, and the content of silver in the silver paste base material is about 65%.

[0095] S404, add 6 g of glacial acetic acid to the beaker, and stir mechanically for 15 minutes to mix the organic acid and the silver paste base material evenly, and then prepare the conductive silver paste.

[0096] After the conductive silver paste that this embodiment makes is tested through above-mentioned test method, the surface appearance of test piece is as follows: Figure 10 shown. see Figure 10 , there is no flocculent or dendritic pattern around the conductive line Figure 4 It is obvious that the silver migration phenomenon of the conductive silver paste...

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Abstract

The embodiment of the invention discloses conductive silver paste, a conductive circuit, a circuit board, a terminal and a preparation method of the conductive silver paste. The conductive silver paste comprises a silver paste base material, and the preparation material of the silver paste base material comprises silver; and the conductive silver paste also comprises an organic acid mixed with thesilver paste base material. The embodiment of the invention has the advantages that the organic acid is added into the silver paste base material, so that the concentration of hydroxyl ions can be reduced, the ionization of silver and the migration to the hydroxyl ions are reduced or even avoided, and the effect of inhibiting silver migration is achieved.

Description

technical field [0001] The present application relates to the technical field of conductive materials, in particular to a conductive silver paste, a conductive circuit, a circuit board, a terminal and a preparation method of the conductive silver paste. Background technique [0002] Silver is widely used in terminals because of its excellent electrical conductivity, heat transfer, solderability, and its ability to be used for contact resistance. For example, silver or silver alloys can be used as protective coatings for other metals in chip resistors, conductive lines of circuit boards, connectors, relays, etc.; can be used as metallized films on glass and ceramics; can be used as polymer materials Conductive fillers and soldering materials in the However, silver plating, silver solder, or silver used as an electrode may migrate after long-term use of terminals containing silver. The migration of silver will cause the insulation performance of the insulator to decrease or ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 唐根初陈汝文简建明周天宝
Owner ANHUI JINGZHUO OPTICAL DISPLAY TECH CO LTD