Substrate cleaning method, substrate cleaning apparatus and storage medium

A technology for cleaning devices and storage media, applied in cleaning methods and utensils, cleaning methods using tools, chemical instruments and methods, etc., capable of solving problems such as insufficient cleaning

Pending Publication Date: 2020-08-14
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This is because, since the area near the edge to be cleaned spreads widely along the outer periphery, if the cleaning is immediately terminated when the outer peripheral end of the swing is reached (the scrub cleaning member is kept away from the substrate), the cleaning becomes insufficient.

Method used

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  • Substrate cleaning method, substrate cleaning apparatus and storage medium
  • Substrate cleaning method, substrate cleaning apparatus and storage medium
  • Substrate cleaning method, substrate cleaning apparatus and storage medium

Examples

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Embodiment Construction

[0034] Hereinafter, embodiments of the present disclosure will be specifically described with reference to the drawings.

[0035] figure 1It is a schematic plan view of the substrate processing apparatus of one embodiment. This substrate processing device is a semiconductor wafer with a diameter of 300 mm or 450 mm, a flat panel, an image sensor such as CMOS (Complementary Metal Oxide Semiconductor) or CCD (Charge Coupled Device: Charge Coupled Device), and MRAM (Magnetoresistive Random Access Memory: A device for processing various substrates in the manufacturing process of the magnetic film in magnetoresistive random access memory). In addition, the shape of the substrate is not limited to a circle, and may be a rectangular shape (square shape) or a polygonal shape.

[0036] The substrate processing apparatus includes: a substantially rectangular housing 1, a loading port 2 for loading and storing a plurality of substrate cassettes, and one or more (in figure 1 In the sho...

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PUM

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Abstract

The invention provides a substrate cleaning method, a substrate cleaning apparatus and a storage medium. The substrate cleaning method includes a step of moving a cleaning member between a first position on a substrate and a second position located near an edge of the substrate in a state where the cleaning member is in contact with the rotating substrate n times (n is an integer of 2 or more), and enabling a control unit that controls a drive unit that moves the cleaning member to control the drive unit such that, in at least one of the first to (n-1)th times, after the cleaning member reaches the second position, the cleaning member is moved to the second position; and an edge cleaning step of cleaning the substrate in a state where the cleaning member is in contact with a second position on the substrate for a predetermined time, and controlling the drive unit so as to perform the edge cleaning step at the time when the cleaning member reaches the second position on the substrate for the n-th time, so as to separate the cleaning member from the substrate.

Description

[0001] Cross-references to related applications [0002] This application is based on Japanese Patent Application No. 2019-020880 filed on February 7, 2019, the disclosure of which is incorporated herein by reference. technical field [0003] The present disclosure relates to a substrate cleaning method and a substrate cleaning device for cleaning a substrate using a cleaning component. Background technique [0004] Patent Document 1 (International Publication No. 2016 / 67562) discloses a substrate cleaning device for cleaning substrates such as semiconductor wafers. In this substrate cleaning device, the surface of the substrate is cleaned by rotating the cleaning member in contact with the substrate. In recent years, in the process of miniaturization and high integration of semiconductor devices, removal of foreign matter generated near the edge of the semiconductor substrate during the manufacturing process of the semiconductor device may become a problem. However, in th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02041H01L21/02082H01L21/67023H01L21/02087H01L21/02096H01L21/67046B08B1/32
Inventor 石桥知淳石川浩西嶋真澄
Owner EBARA CORP
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