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Manufacturing device for semiconductor chips

A technology for preparing devices and semiconductors, which can be used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as corrosion and damage of robotic arms

Active Publication Date: 2021-03-23
SHANGHAI GUONA SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the semiconductor chip preparation devices in the prior art work in an atmospheric environment (generally slightly positive pressure). The transfer robot arm of the semiconductor chip preparation device touches the transfer wafer. After the wafer is produced in the reaction chamber of many process stations, it will The corrosive gas will produce tiny corrosive gas residues, whether the corrosive gas itself or the acid produced by the combination of water vapor in the air will cause corrosion damage to the mechanical arms of the wafer and semiconductor chip preparation equipment

Method used

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  • Manufacturing device for semiconductor chips
  • Manufacturing device for semiconductor chips
  • Manufacturing device for semiconductor chips

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Embodiment Construction

[0027] A semiconductor chip manufacturing device 100 proposed by the present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0028] A semiconductor chip manufacturing apparatus 100 according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0029] The semiconductor chip manufacturing device 100 according to the embodiment of the present invention may include a semiconductor conveying device 1 and a gas cleaning device.

[0030] Such as figure 1 As shown, the semiconductor transfer device 1 includes a robot arm 11 and a vacuum adsorption device 3 (not shown in the figure). During the preparation of the semiconductor chip 5, the semiconductor chip 5 needs to perform multiple processes, and the semiconductor transfer device 1 can clamp The semiconductor chip 5 is transported so that the semiconductor chip 5 can be processed and prepared at multiple proces...

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Abstract

The invention discloses a preparation device of a semiconductor chip, which comprises a semiconductor conveying device and a gas sweeping device, wherein the semiconductor conveying device comprises amechanical arm and a vacuum adsorption device, the mechanical arm is provided with an adsorption hole, and the adsorption hole is communicated with the vacuum adsorption device so as to adsorb the semiconductor chip; and the gas sweeping device is used for spraying sweeping gas to the mechanical arm so as to sweep the mechanical arm. According to the preparation device of the semiconductor chip in the embodiment of the invention, the corrosion damage of corrosive gas to the mechanical arm can be reduced, the pollution to the semiconductor chip conveyed by the mechanical arm can also be reduced, the positive electrode of the semiconductor chip manufacturing device does not need to be shut down for cleaning and maintenance, and the accumulative influence of the corrosive gas on the mechanical arm is reduced to a greater extent.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor chip preparation device. Background technique [0002] Most of the semiconductor chip preparation devices in the prior art work in an atmospheric environment (generally slightly positive pressure). The transfer robot arm of the semiconductor chip preparation device touches the transfer wafer. After the wafer is produced in the reaction chamber of many process stations, it will The corrosive gas will produce tiny corrosive gas residues, whether the corrosive gas itself or the acid produced by the combination of water vapor in the air will cause corrosion damage to the mechanical arms of the wafer and semiconductor chip preparation equipment . Contents of the invention [0003] The object of the present invention is to provide a semiconductor chip preparation device, which can reduce the corrosion damage of the mechanical arm caused by the residual corrosi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67017H01L21/67028H01L21/6838
Inventor 毕迪
Owner SHANGHAI GUONA SEMICON TECH CO LTD