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A kind of diode gluing equipment

A diode and equipment technology, which is applied in the field of diode gluing equipment, can solve the problems of glue dropping, wire drawing, affecting the smoothness of dispensing, and low dispensing efficiency, so as to speed up solidification, improve the efficiency of gluing and packaging, and avoid glue dripping or Brushed effect

Active Publication Date: 2021-05-25
江西兰丰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The development of electronic equipment is changing with each passing day. Every household has a large number of electronic products. The indispensable electronic components in electronic products include diodes. A large part of the production efficiency of electronic diodes comes from the speed of dispensing. At present, the point of electronic components of diodes Glue equipment has the disadvantages of low dispensing efficiency and poor dispensing effect. During the dispensing work, there will be glue dripping and wire drawing, which will block the glue and affect the smoothness of dispensing glue, resulting in a reduction in the dispensing amount, or even no glue. Glue will seriously affect the precision and quality of dispensing, and it will also cause blisters after the glue on the surface of the diode solidifies, which will affect the lighting or use effect

Method used

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  • A kind of diode gluing equipment
  • A kind of diode gluing equipment
  • A kind of diode gluing equipment

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Experimental program
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Effect test

Embodiment 1

[0027] see Figure 1-Figure 3 , the present invention provides a kind of diode gluing equipment, its structure comprises gluing machine 1, diode gluing template 2, electric controller 3, glue injecting device 4, sliding support 5, injecting head 6, described gluing machine 1 is provided with a diode gluing template 2 on the top surface, the gluing machine 1 and the diode gluing template 2 are slidingly fitted, the top of the gluing machine 1 is provided with a sliding bracket 5, and the gluing machine 1 It is movably connected with the sliding bracket 5, the front end of the sliding bracket 5 is provided with a glue injection device 4, the sliding bracket 5 is mechanically connected with the glue injection device 4, and the bottom of the glue injection device 4 is provided with a glue injection device. Head 6, the glue injection device 4 is connected with the glue injection head 6, and the electric controller 3 is installed on the left side of the sliding bracket 5.

[0028] ...

Embodiment 2

[0034] see Figure 1-Figure 5 , the present invention provides a diode gluing device, the glue injection head 6 is composed of a glue injection rod 6a, a fixed ring 6b, a spring 6c, a vibrating block 6d, and a limit ring groove 6e, and the surface of the glue injection rod 6a A fixed ring 6b is provided on the top, and the glue injection rod 6a is fixedly connected with the fixed ring 6b. A vibration block 6d is arranged under the bottom end of the glue injection rod 6a, and the glue injection rod 6a and the vibration block 6d pass through the spring 6c, the spring 6c is arranged on the surface of the glue injection rod 6a, and the inner top of the vibrating block 6d is provided with a limiting ring groove 6e.

[0035] A support ring 6a1 is provided on the surface of the glue injection rod 6a, and the glue injection rod 6a and the support ring 6a1 are an integrated structure.

[0036] A vibrating piece 6d1 is provided under the bottom of the vibrating piece 6d, and the vibrat...

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PUM

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Abstract

The invention discloses a diode gluing device, the structure of which comprises a gluing machine, a diode gluing template, an electric controller, a glue injection device, a sliding bracket, and a glue injection head. Shock absorption, and sealing protection for the glue package, to avoid dust from adhering to the surface of the glue, affecting the packaging effect, and avoiding the glue dripping or wire drawing of the injection head. The auxiliary forming mechanism transfers heat through the semicircular mold. The glue is heated and dried to speed up the solidification of the glue and improve the efficiency of gluing and packaging. Moreover, the heat will not damage the diode element through the semicircle mold. The spring drives the vibrating block to vibrate the cover, so that the cover can transmit the vibration energy to the semicircle. Mold, extrude some bubbles in the glue in the semicircular mold, which improves the precision and quality of dispensing, and also avoids bubbles in the glue after packaging.

Description

technical field [0001] The invention relates to the field of diode processing, in particular to a diode gluing device. Background technique [0002] Glue dispensing is a process, also known as sizing, gluing, glue pouring, glue dropping, etc. It is to smear, fill, and drop electronic glue, oil or other liquids on the product, so that the product can stick and fill. Sealing, insulation, fixing, smooth surface and so on. [0003] The development of electronic equipment is changing with each passing day. Every household has a large number of electronic products. The indispensable electronic components in electronic products include diodes. A large part of the production efficiency of electronic diodes comes from the speed of dispensing. At present, the point of electronic components of diodes Glue equipment has the disadvantages of low dispensing efficiency and poor dispensing effect. During the dispensing work, there will be glue dripping and wire drawing, which will block th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C9/14B05C13/02B05C11/08B05D3/02B05B15/50
CPCB05C5/0208B05C9/14B05C11/08B05C13/02B05D3/0254B05B15/50
Inventor 杨炳军
Owner 江西兰丰科技有限公司