An Ultrasonic Vibration Assisted Vacuum Micro Evaporation Plating Equipment

A technology of ultrasonic vibration and evaporation plating, used in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of uneven carbide layer, uneven surface plating of diamond particles, etc., to achieve uniform temperature Effect

Active Publication Date: 2021-04-20
南京长江工业技术研究院有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0006] The present invention aims at the problem of non-uniform coating on the surface of diamond particles and non-uniform carbide layer in the vacuum micro-evaporation plating process existing in the prior art, and hereby provides an ultrasonic vibration-assisted vacuum micro-evaporation plating equipment. The vacuum micro-evaporation deposition equipment includes a heating system, a cooling system for cooling the heating chamber, an ultrasonic vibration auxiliary device, and an air pressure system providing vacuum conditions for the heating chamber, which solves the defects in the prior art

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  • An Ultrasonic Vibration Assisted Vacuum Micro Evaporation Plating Equipment
  • An Ultrasonic Vibration Assisted Vacuum Micro Evaporation Plating Equipment
  • An Ultrasonic Vibration Assisted Vacuum Micro Evaporation Plating Equipment

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[0024] In order to make the object, technical solution and effect of the present invention clearer and clearer, the following examples are given to further describe the present invention in detail. It should be pointed out that the specific implementations described here are only used to explain the present invention, not to limit the present invention.

[0025] Such as Figure 2~Figure 3 As shown, the heating chamber 1 includes a vacuum box cover 101, a detachable micro-deposition crucible 110, a graphite heating electrode 102 for heating the micro-deposition crucible, and the confluence and arrangement of the current, liquid flow and air flow in the entire device The bus board 105 and the insulating and heat insulating board 104.

[0026] When the vacuum micro-evaporation plating process is carried out, the micro-deposition crucible 110 is located above the manifold 105, and there is a layer of insulating and heat-insulating plate 104 between the manifold and the micro-depo...

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Abstract

The invention discloses a vacuum micro-evaporation plating equipment assisted by ultrasonic vibration, which belongs to the technical field of evaporation equipment. A crucible, a manifold is arranged below the micro-deposition crucible; graphite heating electrodes are arranged around the micro-deposition crucible, and the graphite heating electrodes are connected to the manifold by a soft busbar; the interior of the manifold is provided with Ultrasonic vibration auxiliary system, the ultrasonic vibration auxiliary system includes a horn and a transducer arranged under the horn, the transducer is connected to the circuit in the manifold, and the horn is located in the micro-deposition crucible Directly below; the present invention uses graphite electrodes to directly heat the micro-deposition crucible, reducing electricity and heat energy loss, and making the internal temperature of the crucible uniform during the plating process.

Description

technical field [0001] The invention relates to the technical field of evaporation equipment, in particular to an ultrasonic vibration-assisted vacuum micro-evaporation equipment. Background technique [0002] With the continuous deepening of crossover between various disciplines, the continuous development of 5G and other communication technologies and the chip industry, the country's demand for the quantity and quality of electronic products is increasing day by day, and the thermal conductivity of traditional copper-based and aluminum-based alloy-based heat sink materials has gradually increased. Can't meet demand. The thermal conductivity of natural diamond can reach up to 2000W / m K. Under the current technical conditions, the thermal conductivity of artificial diamond can also reach 1000~1500W / m K. The diamond / copper composite material synthesized by diamond and copper Theoretically, it can reach a thermal conductivity of 1000W / m·K, but due to the poor wettability of d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/18
CPCC23C14/18C23C14/24
Inventor 王长瑞李治佑李宏钊敬奇陈明和谢兰生
Owner 南京长江工业技术研究院有限公司
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