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Preparation process and finished product of a heat-conducting wave-absorbing tape

A preparation process and technology of thermally conductive coating, applied in the field of preparation of thermally conductive wave-absorbing materials, can solve the problem that thermally-conductive wave-absorbing films are difficult to take into account high thermal conductivity and low-frequency electromagnetic wave absorption, etc., and achieve separation and controllable thermal conductivity improvement and thermal resistance improvement. , the effect of filtering frequency reduction

Active Publication Date: 2022-04-19
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The main purpose of the present invention is to provide a preparation process of heat-conducting and wave-absorbing tape. The main progress lies in the combination of manufacturing process and multi-layer structure to solve the problem that the heat-conducting wave-absorbing film is difficult to take into account high heat conduction and low-frequency electromagnetic wave absorption. The process improvement lies in the back-end process of the absorbing material diaphragm

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  • Preparation process and finished product of a heat-conducting wave-absorbing tape
  • Preparation process and finished product of a heat-conducting wave-absorbing tape
  • Preparation process and finished product of a heat-conducting wave-absorbing tape

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Embodiment Construction

[0052] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only part of the embodiments for understanding the inventive concepts of the present invention, and cannot represent All the embodiments are not explained as the only embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art on the premise of understanding the inventive concepts of the present invention fall within the protection scope of the present invention.

[0053] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the relationship between the components in a certain posture. If the specific postu...

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Abstract

The invention relates to a preparation process of a heat-conducting wave-absorbing tape and its finished product. The preparation process sequentially includes: providing a wave-absorbing core film with a wave-cutting through hole to determine the wave-absorbing performance; forming a heat-conducting slurry on the upper and lower surfaces of the wave-absorbing core film ; Form a multi-layer tape body by rolling or scraping to determine the thermal conductivity and film thickness; heat and vulcanize the thermally conductive paste that forms the upper and lower films. The upper and lower heat conduction pastes are integrated and connected to the wave cut-off through hole to form a heat conduction channel. The above steps are continuously implemented in the process of introducing and winding the primary tape of the absorbing core film. The invention has the effects of reducing the filtering frequency of separated controllable electromagnetic waves, increasing the thermal conductivity of separated controllable and adjusting the film thickness in the manufacturing process through one-stop continuous production.

Description

technical field [0001] The invention relates to the technical field of preparation of heat-conducting and wave-absorbing materials for electronic materials, in particular to a preparation process of heat-conducting and wave-absorbing tape and its finished product. Background technique [0002] In the prior art, there are diaphragm-shaped heat-conducting and wave-absorbing materials, which can be divided into a multi-layer structure with separate functions and a multi-functional single-layer integrated structure. Although it is called heat conduction and wave absorption, its thermal conductivity is generally below 3 W / (m K). If it is a multi-layer structure with separate functions, under the thermal barrier of the wave-absorbing material layer, the vertical thermal conductivity of the surface will be worse. On the one hand, in order to improve the thermal conductivity, the conventional method is to change the ratio of the thermal conductivity material. When the thermal condu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00B32B3/24B32B25/20B32B25/14B32B27/40B32B27/38B32B27/30B32B27/18B32B7/06B32B33/00
CPCH05K9/009B32B3/266B32B25/20B32B25/14B32B27/40B32B27/38B32B27/308B32B27/18B32B7/06B32B33/00B32B2255/10B32B2255/26B32B2307/302
Inventor 窦兰月王自领
Owner SHENZHEN HFC SHIELDING PRODS CO LTD