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Laser processing method

A laser processing method and technology of a laser processing head, which are applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of inability to realize the thickness measurement of processed plates, affecting the production efficiency and economic benefits of the factory, and reduce the measurement Error, improve measurement efficiency, improve the effect of stability

Active Publication Date: 2020-09-04
FOSHAN HONGSHI LASER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although this patent realizes the height position calibration of the laser cutting head, it cannot realize the measurement of the thickness of the processed plate
[0006] The traditional geometric quantity measurement technology for processing plate thickness is basically a linear scale, or a vernier, or a micrometer or other mechanical micrometers, relying on manual measurement, and finally the operator enters the laser cutting machine and calls out The cutting parameters corresponding to the thickness of the plate are used for cutting and processing. In this way, the time and the number of personnel spent on measurement are considerable, which seriously affects the production efficiency and economic benefits of the factory.

Method used

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Experimental program
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Embodiment 1

[0043] refer to figure 1 , this embodiment discloses a laser processing head, including a laser head body 1 and an ultrasonic thickness measuring device 2 arranged on the laser head body 1;

[0044] The laser head body 1 includes a housing 101, a fiber laser head 102, an optical lens 103, a capacitive sensor 104 and a nozzle 105. The fiber laser head 102 is arranged on the upper end of the housing 101, the optical lens 103 is arranged in the housing 101, and the capacitive sensor 104 Both the device and the nozzle 105 are fixed on the lower end of the housing 101, and the laser light emitted by the fiber laser head 102 is focused toward the direction of the nozzle 105 through the optical lens 103, and finally ejected from the nozzle 105. With the capacitance value between the surface of the workpiece 9 to be processed on the workbench, the laser head body 1 also includes a numerical control unit (not shown in the figure), the capacitance sensor 104 is electrically connected wi...

Embodiment 2

[0055] refer to image 3 , this embodiment discloses another laser processing head. Based on Embodiment 1, the differences between this embodiment and Embodiment 1 are:

[0056] A protective cover 8 is also provided on the laser head body 1 , and the ultrasonic thickness measuring device 2 can be accommodated in the protective cover 8 .

[0057] refer to image 3 , the protective cover 8 is fixedly connected with the laser head body 1, and the protective cover 8 is provided with a through hole 801 for the thickness measuring probe 201 to pass through. Inside the cover 8.

[0058] Further, a switch door (not shown in the figure) may also be provided on the protective cover 8 for opening and closing the through hole 801 , so as to further improve the protection effect on the thickness measuring probe 201 .

Embodiment 3

[0060] refer to Figure 4 , this embodiment discloses a laser processing method, this embodiment uses the laser processing head disclosed in the above embodiment, based on the above embodiment, includes the following processing steps:

[0061] S1: Loading to the workbench: loading the workpiece 9 to be processed onto the workbench through a conventional feeding method;

[0062] S2: Select the type of material: The laser processing head of this laser processing method also works with the laser cutting control system in conventional technology. Because different types of materials correspond to different cutting process parameters when cutting, by setting in the laser cutting control system Cutting parameters, select the type of material;

[0063] S3: Calibration of the laser processing head, measuring the thickness of the workpiece 9 to be processed by the ultrasonic thickness measuring device 2;

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Abstract

The invention discloses a laser processing method, and belongs to the field of laser processing. A laser processing head is applied to the method, and comprises a laser head body and an ultrasonic thickness measuring device, the ultrasonic thickness measuring device is movably mounted on the laser head body, a driving assembly is mounted on the laser head body, and the laser processing method comprises the following steps of S1, loading to a worktable; S2, material kind selecting; S3, laser machining head marking, wherein through the ultrasonic thickness measuring device, the thickness of a workpiece to be machined is measured; and S4, laser processing. The laser processing method is provided, an improved laser processing head is adopted, and comprises the laser head body and the ultrasonic thickness measuring device, through the ultrasonic thickness measuring device, the thickness of the machined workpiece is measured, after the laser processing head body is calibrated, thickness determining of the workpiece to be machined can be finished, manual measuring troublesome can be reduced, the measuring efficiency is improved, and the machining efficiency is improved.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser processing method. Background technique [0002] In the field of laser processing, when using laser for cutting and welding, laser processing equipment is required, and the laser processing head is an important part of the laser processing equipment. on, and adjust the position of the focus as needed to achieve the purpose of cutting and melting the workpiece to be processed, and finally complete the cutting and welding operations of the workpiece to be processed. [0003] For traditional laser cutting machines, before cutting, the material to be processed is first placed on the processing table, and the thickness information of the material is very important information for laser cutting. Different thicknesses correspond to different cutting parameters. , cutting parameters include cutting speed, cutting focus position, cutting gas pressure, etc., so before cutting, it i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/70G01B17/02
CPCB23K26/00B23K26/702G01B17/02
Inventor 刘洋常勇
Owner FOSHAN HONGSHI LASER TECH CO LTD