Chip testing device and chip testing method

Abstract

The invention discloses a chip testing device and a chip testing method. The test device comprises a test equipment main body, a workbench and a test frame; a lifting plate is arranged at the upper end of the test frame, and the lifting plate is connected with the test frame through a telescopic rod; a pressing plate is arranged below the lifting plate; the pressing plate is connected with the lifting plate through a connecting column; and a detection plate is arranged on the lower surface of the pressing plate. According to the chip testing device and the chip testing method, a limiting device can be moved, and loosening when a fixing column is combined with a fixing hole is avoided; the chip in a placing cavity is prevented from being crushed by the pressing plate; the chip testing device is practical; a pull rod is pulled to drive a connecting block to move; the chip is fixed under the action of a second telescopic spring; the chip is prevented from deviating during detection; an air bag between baffles is prevented from being pressed; the air bag makes contact with a contact gasket, buffering is reduced, and the chip in the placing cavity or a fixing table is prevented from being damaged.

Description

technical field [0001] The invention relates to the field of chip testing devices, in particular to a chip testing device and a chip testing method. Background technique [0002] Chip testing is a relatively big problem, which directly runs through the entire chip design and mass production process. Usually, we grow single crystals by pulling and growing according to the 111 crystal orientation, but due to various external factors, such as temperature, pulling speed , and various randomness of quantum mechanics, resulting in dislocations during the growth process, which are called defects. Another reason for defects is the irregular structure caused by ion implantation, which cannot be corrected even after annealing. These problems in semiconductors will lead to device failure, which in turn affects the entire chip, making it necessary to test the chip In order to obtain a qualified chip product, it needs to be tested by a chip testing device. However, there are certain di...

AI Technical Summary

Problems solved by technology

[0002] Chip testing is a relatively big problem, which directly runs through the entire chip design and mass production process. Usually, we grow single crystals by pulling and growing according to the 111 crystal orientation, but due to various external factors, such as temperature, pulling speed , and various randomness of quantum mechanics, resulting in dislocations during the growth process, which are called defects

Another reason for defects is the irregular structure caused by ion implantation, which cannot be corrected even after annealing. These problems in semiconductors will lead to device failure, which in turn affects the entire chip, making it necessary to test the chip In order to obtain qualified chip products, it needs to be tested by chip testing equipment

However, there are certain disadvantages in the existing testing devices. Firstly, when installing the chip, the chip is directly put into the installation slot, and cannot be fixed. When the chip is tested by the test board, the chip is easily crushed, causing the chip to be damaged. It cannot be used, and the contact between the movable plate and the fixed plate is relatively fast, which will cause impact and affect the stability of the equipment

Images