Temperature control method and system

Abstract

The invention provides a temperature control method and system and semiconductor equipment. The temperature control method is used for controlling the temperature change of a chamber. The method comprises the following steps: establishing a model: controlling a chamber heating device to output different test power values to the chamber, obtaining actual temperature values, corresponding to the test power values, of the chamber, and establishing a model according to the relationship between the actual temperature values and the test power values, wherein the model is used for representing the relationship between the chamber temperature and the heating power; calculating a global parameter table based on the model, wherein the global parameter table is used for representing a correspondingrelationship between the chamber temperature value and the heating power value; and controlling the heating power value output by the chamber heating device according to the global parameter table soas to control the temperature change of the chamber. According to the invention, the temperature of the chamber is flexibly and accurately controlled.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, in particular to a temperature control method and system. Background technique [0002] At present, the temperature control system has an important impact on the consistency of film deposition quality during the PVD (Physical Vapor Deposition, physical vapor deposition) process, and the fluctuation and inaccuracy of the chamber temperature will inevitably greatly reduce the process results of the wafer. [0003] Specifically, the block diagram of the temperature control system is shown as figure 1 as shown, figure 1 In the chamber 1', each heater 2' is grouped by area, and the heaters 2' in the same group are controlled by the same power controller. The temperature measurement adopts the contact thermocouple measurement method, the thermocouple 3' measures the temperature and sends the measurement result to the temperature controller, the temperature controller generates a con...

AI Technical Summary

Problems solved by technology

[0005] 1. At present, most of the control links in the temperature controller adopt PID (Proportional Integral Derivative, proportional integral derivative) control. Although the theoretical basis of PID control is sufficient, the response speed of PID control itself is not good enough, resulting in the overshoot of its control. Relatively poor performance, there will be a short-term temperature shock under high-temperature use, and the temperature fluctuation is relatively large

[0006] 2. The main engine outputs the set temperature to the temperature controller. The specific control depends on the parameter setting of the temperature controller itself. The change of the control strategy needs to readjust the parameters of the temperature controller, and the change of the PID parameter has a certain influence on the control result. Unpredictability, so the client's autonomous intelligence is relatively poor

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