Image processing method and system, medium, chip and structural optoelectronic equipment

An image processing and optoelectronic technology, applied in the field of image processing, can solve problems such as reducing system performance and image acquisition and processing efficiency, and achieve the effect of improving processing efficiency, reducing workload, and optimal system performance

Inactive Publication Date: 2020-09-15
FUZHOU ROCKCHIP SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since all operations need to be initiated through the AP, the efficiency of image acquisition and processing is reduced, and the system performance is also reduced.

Method used

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  • Image processing method and system, medium, chip and structural optoelectronic equipment
  • Image processing method and system, medium, chip and structural optoelectronic equipment
  • Image processing method and system, medium, chip and structural optoelectronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Such as image 3 As shown, in this embodiment, the image processing unit 130 sends a shooting instruction to the infrared camera 115; the infrared camera 115 acquires an infrared image 211 of a 3D object according to the received shooting instruction, and sends the infrared image 211 is sent to the image processing unit 130. The image processing unit 130 performs image processing on the infrared image 211 , acquires 3D information 221 of the infrared image 211 , and sends the 3D information 221 to the application processing unit 140 through a data line.

[0076] The application processing unit 140 sends a shooting instruction to the color camera 117, and the color camera 117 acquires a color image 212 of a 3D object according to the received shooting instruction, and sends the color image 212 to the application processing unit 140 .

[0077] The application processing unit 140 performs processing according to the received 3D information 221 and the color image 212, th...

Embodiment 2

[0080] Such as Figure 4 As shown, in this embodiment, the application processing module 140 sends a shooting instruction to the infrared camera 115 and the color camera 117 . The infrared camera 115 acquires an infrared image 231 of a 3D object according to the received shooting instruction, and sends the infrared image 231 to the application processing unit 140 . The color camera 117 acquires a color image 232 of a 3D object according to the received shooting instruction, and sends the color image 232 to the application processing unit 140 .

[0081] . The application processing unit 140 sends the received infrared image 231 (or color image 232) to the image processing unit 130; the image processing unit 130 images the infrared image 231 (or color image 232) processing to obtain 3D information 241 of the infrared image 231 , and send the 3D information 241 to the application processing unit 140 through a data line.

[0082] The application processing unit 140 performs proc...

Embodiment 3

[0085] Such as Figure 5 As shown, in this embodiment, the image processing unit 130 sends a shooting instruction to the infrared camera 115 and the color camera 117 . The infrared camera 115 acquires an infrared image 251 of a 3D object according to the received shooting instruction, and sends the infrared image 251 to the image processing unit 130 . The color camera 117 acquires a color image 252 of a 3D object according to the received shooting instruction, and sends the color image 252 to the image processing unit 130 .

[0086]The image processing unit 130 performs image processing on the infrared image 251 , acquires 3D information 261 , and sends the 3D information 261 and the color image 252 to the application processing unit 140 .

[0087] The application processing unit 140 performs processing according to the received 3D information 261 and the color image 252, thereby obtaining the RGB-D image 262 of the infrared image 251 and the color image 252, which helps real...

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PUM

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Abstract

The invention provides an image processing method and system, a medium, a chip and structural optoelectronic equipment. An image processing unit is used for transmitting a control instruction to an infrared laser transmitting unit and an infrared LED, and generating the 3D information of an infrared image according to the received infrared image; the infrared laser transmitting unit and the infrared LED are used for sending infrared characteristic light to a 3D object according to the control instruction; the infrared camera and the color camera are used for respectively shooting an infrared image and a color image of the 3D object based on the infrared characteristic light according to the shooting instruction; and the application processing unit is used for generating an RGB-D image of the 3D object according to the received color image and 3D information. According to the image processing method, system, the medium, the chip and the structural optoelectronic equipment, the independent image processing unit is arranged for data acquisition and processing, so that the workload of an AP is reduced, and the image acquisition and processing efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of image processing, in particular to an image processing method, system, medium, chip and structured optoelectronic equipment. Background technique [0002] In the prior art, image acquisition and image recognition are mostly aimed at two-dimensional images. In some security verification scenarios, there are certain security risks in the collection and recognition of two-dimensional images, and it is impossible to accurately determine whether the object in the image is the object itself. Therefore, structured light came into being. Structured light is a system structure composed of a projector and a camera. After the projector projects specific light information onto the surface of the object and the background, it is collected by the camera, and the position and position of the object are calculated according to the change of the light signal caused by the object. Depth and other information, and then re...

Claims

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Application Information

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IPC IPC(8): H04N5/225H04N5/232H04N5/235H04N5/247H04N5/33G06T1/20
CPCH04N5/33G06T1/20H04N23/50H04N23/56H04N23/57H04N23/55H04N23/54H04N23/60H04N23/80H04N23/74H04N23/90
Inventor 戴伦学
Owner FUZHOU ROCKCHIP SEMICON
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