Compensation capacitor structure and capacitance value increasing method thereof
A technology for compensating capacitors and capacitors, which is applied in the OLED field, can solve problems such as breakdown, lower aperture ratio, and inability to reduce device size, etc., to achieve the effect of increasing capacitance, increasing aperture ratio, and improving display quality
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Embodiment 1
[0051] Please refer to figure 1 , Embodiment 1 of the present invention is:
[0052] A compensation capacitance structure, comprising a capacitance region structure 1, the capacitance region structure 1 comprising a glass layer 4, on the surface of the glass layer 4 of the capacitance region structure 1, a first metal layer 5 and a first insulating layer are sequentially laminated 6. A semiconductor layer 7, a second metal layer 8, a second insulating layer 9 and a third metal layer 10;
[0053] The first insulating layer 6 of the capacitive region structure 1 is provided with a first via hole, the second metal layer 8 of the capacitive region structure 1 is provided with a second via hole, and the second insulating layer of the capacitive region structure 1 Layer 9 is provided with a third via hole, the third via hole, the second via hole and the first via hole are oppositely arranged and communicated, and the third via hole, the second via hole and the first via hole are al...
Embodiment 2
[0064] Please refer to figure 2 , the second embodiment of the present invention is:
[0065] A method for improving the capacitance of a compensation capacitor structure, comprising the following steps:
[0066] S1, providing a glass layer 4 of the capacitive region structure 1, and covering the surface of the glass layer 4 with a first metal layer 5;
[0067] S2, forming a first insulating layer 6 and covering the surface of the first metal layer 5;
[0068] S3, forming a semiconductor layer 7 and covering the surface of the first insulating layer 6;
[0069] S4, forming a second metal layer 8 and covering the surface of the semiconductor layer 7;
[0070] S5, forming a second insulating layer 9 and covering the surface of the second metal layer 8;
[0071] S6, forming a first via hole in the first insulating layer 6, forming a second via hole in the second metal layer 8, forming a third via hole in the second insulating layer 9, the third via hole, the second via hole ...
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