Glue dispenser assembly for diode packaging
A dispensing machine and diode technology, applied to mixers with rotating stirring devices, mixers, electrical components, etc., can solve problems such as difficult glue extrusion, affecting work efficiency, high viscosity of epoxy resin, etc., to prevent The effect of precipitation of internal components
Active Publication Date: 2020-09-22
佛山市磊鑫光电科技有限公司
View PDF6 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides a dispensing machine assembly for diode packaging, which has the advantages of preventing the precipitation of the internal components of the epoxy resin glue, changing the internal pressure of the dispensing head so that the glue can be squeezed out quickly , to solve the problem that the process of diode packaging is relatively long, and the epoxy resin is prone to precipitation, which makes its internal composition uneven and affects the dispensing effect, and the viscosity of the epoxy resin required in some special cases is relatively high, and the commonly used dispensing It is difficult to quickly squeeze out the glue, which affects work efficiency
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] see Figure 1-6 , a dispensing machine assembly for diode packaging, including a dispensing head 1, a rotating ring 2 is sleeved on the outside of the dispensing head 1, a push rod 3 is fixedly connected to the back of the dispensing head 1, and the push rod 3 is far away from the point One end of the glue head 1 is connected to the moving mechanism of the glue head 1, and the top of the push rod 3 is fixedly connected with a drawstring 4, and the botto...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the technical field of diode packaging and discloses a glue dispenser assembly for diode packaging. The glue dispenser assembly comprises a glue dispensing head; a rotary ringis connected with the external part of the glue dispensing head in a sleeving manner; and a pushing rod is fixedly connected with the back of the glue dispensing head. According to the glue dispenserassembly, the rotary ring is rotated to change the position of a lug in the glue dispensing head so as to change the pressure intensity in the glue dispensing head, so that epoxy resin adhesives withdifferent viscosities can be rapidly dispensed, and the effect that the internal pressure of the glue dispensing head is changed to rapidly extrude the glue is realized. During the glue dispensing process, the glue dispensing head continuously moves and the thread of a driving shaft is matched with that of a rotary disc, so that the rotary disc rotates when the driving shaft moves; and as a stirring mechanism is fixedly connected with the bottom of the rotary disc, epoxy resin adhesive is stirred to realize the effect that sedimentation of internal compositions in the epoxy resin adhesive isprevented.
Description
technical field [0001] The invention relates to the technical field of diode packaging, in particular to a glue dispenser assembly for diode packaging. Background technique [0002] Diode packaging refers to connecting the circuit pins on the silicon chip to the external joints with wires in order to connect with other components. The chip inside the packaged diode must be isolated from the outside world to prevent impurities in the air from affecting the chip. Corrosion of the circuit causes electrical performance to decline, so most packaged diodes are packaged with epoxy resin glue for dispensing and packaging. When epoxy resin glue is used for packaging, a dispensing machine is required to complete the dispensing work. [0003] The dispensing machine is specialized in controlling the fluid, and dripping and coating the fluid on the surface of the product. Since the process of diode packaging is relatively long, during the dispensing process, the components inside the epo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/10H01L21/56B01F7/24
CPCB05C5/0208B05C11/1002H01L21/56B01F27/92
Inventor 万玲兰
Owner 佛山市磊鑫光电科技有限公司