Unlock instant, AI-driven research and patent intelligence for your innovation.

Device fixing device and semiconductor laser testing equipment

A technology for fixing devices and devices, which is applied in the direction of single semiconductor device testing, measuring devices, electronic circuit testing, etc., can solve the problems of not being able to fix devices stably, and achieve the effects of stably fixing devices, increasing the pressure difference, and increasing the fixing pressure

Active Publication Date: 2020-11-17
江西德瑞光电技术有限责任公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, the object of the present invention is to provide a device fixing device and semiconductor laser testing equipment to solve the technical problem that the device fixing device in the prior art cannot stably fix the device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device fixing device and semiconductor laser testing equipment
  • Device fixing device and semiconductor laser testing equipment
  • Device fixing device and semiconductor laser testing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] see Figure 1-Figure 3 , shown is the device fixing device 100 in the first embodiment of the present invention, which includes a base 10, a plurality of sensing parts arranged on the top of the base 10, and a plurality of airway switch assemblies 30 arranged in the base 10, wherein:

[0036] The top of the base 10 is a device fixing platform. The top of the base 10 is provided with a number of adsorption holes 11. Each adsorption hole 11 is communicated with a vacuum pump (not shown) through its own vacuum channel 12, and the vacuum channel 12 is set. Inside the base 10 , that is, the vacuum channels 12 are holes or cavities opened on the base 10 , and the vacuum channels 12 of each adsorption hole 11 are independently arranged. Preferably, as figure 1 As shown, each adsorption hole 11 is evenly arranged in an array, so that the device 200 placed on the top of the base 10 can be better and more uniformly adsorbed and fixed.

[0037] Each suction hole 11 is correspond...

Embodiment 2

[0047] see Figure 4-Figure 7 , the device fixing device 100 in the second embodiment of the present invention is described. The device fixing device 100 in this embodiment is different from the device fixing device 100 in the first embodiment in that:

[0048] In this embodiment, as Figure 4 and Figure 5 As shown, the sensing component is a piezoelectric sensor 22 disposed on one side of the adsorption hole 11 . Specifically, a mounting hole 14 is opened on one side of the adsorption hole 11 , and the piezoelectric sensor 22 is installed in the mounting hole 14 . The airway switch assembly 30 includes: a piston 33 that seals and separates the suction hole 11 and the vacuum airway 12, a drive assembly 34 that drives the piston 33 to move, and a wire ( Image 6 and Figure 7 The control device 35 is electrically connected with the piezoelectric sensor 22 and the driving component 34; the piston 33 is provided with a communication hole 331, when the piezoelectric sensor 22 ...

Embodiment 3

[0056] A third embodiment of the present invention further provides a semiconductor laser testing equipment, including a device grabbing device, a vacuum pump, and a device fixing device, the device fixing device being the device fixing device described in any one of the foregoing Embodiments 1-2 100. The device grabbing device is used to grab the device to the device fixing device, and the vacuum pump is connected to the air channel of the device fixing device to generate a vacuum to adsorb and fix the device on the device fixing device, so as to facilitate the testing of the device, wherein the device is: Diode laser chips or bars.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a device fixing device and semiconductor laser testing equipment. The device comprises a base, wherein a plurality of adsorption holes are formed in the top of the base, each adsorption hole is communicated with a vacuum pump through a respective vacuum air channel, the device further comprises a plurality of sensing components arranged at the top of the base, and a plurality of air channel switch assemblies arranged in the base, the position where each adsorption hole is located is correspondingly provided with one sensing component, each air channel switch assembly controls the on-off of one vacuum air channel, and the air channel switch assemblies are linked with the corresponding sensing components. According to the invention, only the area pressed and covered bythe device can generate suction force, and the non-pressing-covering area does not generate suction force, so that the pressure difference between the two sides of the device is improved to achieve the purpose of effectively increasing the fixing pressure so as to stably fix the device.

Description

technical field [0001] The invention relates to the technical field of semiconductor laser testing, in particular to a device fixing device and semiconductor laser testing equipment. Background technique [0002] At present, the commonly used semiconductor laser testing equipment needs to place the semiconductor laser chip or bar to be tested on the device fixing device of the heat dissipation platform before testing, and then fix it by vacuum adsorption, and then complete the necessary testing work. [0003] However, due to the diversification of the dimensions of semiconductor laser chips or bars, the vacuum adsorption pores on the device fixing device are usually simple metal holes or pores, which have been processed and shaped before use, and cannot match the size of all types of lasers, and are full coverage. Therefore, the fixing device of the conventional type semiconductor laser chip or bar often causes the pressure difference on both sides (the side facing the fixi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/04G01R31/26G01R31/28
CPCG01R1/0408G01R31/2601G01R31/2851G01R31/2893
Inventor 蒋锴李春勇舒凯仇伯仓柯毛龙徐化勇冯欧
Owner 江西德瑞光电技术有限责任公司