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A metal and non-metal material laser shock glue riveting connection device and method

A non-metallic material, laser shock technology, applied in the field of material glue riveting, can solve the problem of oversize, achieve the effect of light weight, avoid material damage, avoid interaction or electrochemical corrosion

Active Publication Date: 2021-11-26
JILIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention designs and develops a metal and non-metallic material laser shock glue riveting connection device, through the cooperation of the laser generator and the laser shock layer, the plates are riveted, and the preliminarily obtained joint is subjected to secondary curing, which can overcome the existing metal and non-metallic materials. Non-metallic materials are difficult to connect and the size is too large to improve the quality of the joint

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  • A metal and non-metal material laser shock glue riveting connection device and method
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  • A metal and non-metal material laser shock glue riveting connection device and method

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Embodiment Construction

[0053] The present invention will be further described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it with reference to the description.

[0054] Such as figure 1 As shown in -4, the present invention provides a laser shock glue riveting connection device for metal and non-metal materials, including: a die 100, a metal sheet layer 210, an adhesive layer 220, a non-metal sheet layer 230, an absorption layer 310, and a constraining layer 320 , the first connection hole 330 , the blank holder 400 , the second connection hole 410 , and the laser generator 500 .

[0055]The die 100 is placed horizontally and has a notch opening upwards. The plate mechanism to be riveted is placed on the die 100 and covers the notch. The blank holder 400 is set on the plate mechanism to be riveted, and the laser shock layer is set on the bezel. Inside 400, the laser generator 500 is supported on the top of the blank holder 400; where...

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Abstract

The invention discloses a metal and non-metallic material laser shock glue riveting connection device, a concave mold; a blank holder, which is arranged on the top of the concave mold; a laser shock layer, which is arranged in the blank holder, and Located on the top of the die; a laser generator, which is supported on the top of the blank holder; at least one first connection hole, which is opened on the laser shock layer; at least one second connection hole, which is opened At the top of the blank holder; at least one connecting pipe, one end of which is arranged in the die after passing through the second connecting hole and the first connecting hole in sequence; a pressure regulating mechanism, which is connected to the The other end of the pipe is communicated for delivering gas into the connecting pipe; the cooling water chamber is arranged at the lower part of the die; the heater is arranged outside the die; the device can realize the joint Secondary curing to improve joint quality. The invention also provides a laser impact glue riveting method for metal and non-metal materials.

Description

technical field [0001] The invention relates to a laser impact glue riveting connection method for metal and nonmetal materials, and belongs to the technical field of material glue riveting connection. Background technique [0002] Non-metallic materials such as plastics are widely used because of their low density and easy molding, which meet the requirements of small, light, and portable electronic products. Electronic components continue to develop and innovate, and lightweight and miniaturization are inevitable development trends. The use of new lightweight materials is certainly one aspect, and more advanced material connection technology is also one of the important factors affecting lightweight. The self-piercing riveting, rivetless riveting technology and bonding technology that have emerged in recent years have effectively reduced the quality of material joints and promoted the development of lightweight technology. [0003] However, the rivets used in self-pierci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/16B29C65/48B29C65/78B29C65/00B29L9/00B29L7/00
CPCB29C65/1635B29C65/48B29C65/7802B29C66/00141B29C66/41B29L2007/002B29L2009/003
Inventor 庄蔚敏陈沈施宏达
Owner JILIN UNIV
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