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Method for forming multiple electrical components and single electrical component manufactured by the method

A technology of electrical components and electrodes, which is applied in the direction of electrical components, printed circuits connected with non-printed electrical components, and inductance/transformer/magnet manufacturing, etc. It can solve the problems of large lead frame space, pressure difference, and increased coil resistance

Pending Publication Date: 2020-09-29
CYNTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of lead frames requires a lot of space and is not suitable for electrodes of smaller electrical components, such as inductors
In addition, due to the pressure difference between the bump and the filled magnetic powder, the coil is easily deformed after heating and pressing, so that the particles of the magnetic powder penetrate into the insulating layer of the coil, causing a short circuit and increasing the coil resistance

Method used

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  • Method for forming multiple electrical components and single electrical component manufactured by the method
  • Method for forming multiple electrical components and single electrical component manufactured by the method
  • Method for forming multiple electrical components and single electrical component manufactured by the method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0054] see Figures 2A-2J ,Such as Figure 2A As shown, a plurality of through holes 201b are formed in the first magnetic sheet 201, wherein the first magnetic sheet includes a plurality of protrusions 201c on the upper surface 201a of the first magnetic sheet, such as bumps or pillars, wherein each of the first magnetic sheet 201 Element 201u in Figure 2A-1 Shown; Next, a plurality of coils 203 are arranged on the first magnetic sheet 201 to form as Figure 2D The structure 204 shown, wherein each coil 203 is formed by a corresponding wire, such as Figure 2C As shown, one end 203a of each wire is disposed in the corresponding through hole 201b of the first magnetic sheet 201, as Figure 2D-1 shown; Next, the second magnetic sheet 202 is disposed on the first magnetic sheet 201 to form a structure 205, wherein the second magnetic sheet 202 includes a plurality of through holes 202a, such as Figure 2B As shown, each element 202u of the second magnetic sheet 202 is in ...

no. 2 example

[0061] This embodiment is similar to the above-mentioned first embodiment, wherein instead of printing the magnetic and adhesive material 206a on the second magnetic sheet 202 to encapsulate the coil 203 as described in the first embodiment, another A magnetic layer or sheet is used to encapsulate the coil 203 . That is, in Figure 2G In this example, instead of encapsulating the coil 203 with the magnetic and adhesive material 206a to form the first structure 206, the magnetic and adhesive material 206a is changed to a magnetic layer disposed on the second magnetic sheet to encapsulate the coil 203 to form the first structure 206. The description of other details can be inferred from the first embodiment, so this second embodiment will not be further described here.

no. 3 example

[0063] The first magnetic sheet 201, such as Figure 2A As shown, here as Figure 3A Provided in (for the description of the first magnetic sheet 201, please refer to the first embodiment); a plurality of coils 203 are arranged on the first magnetic sheet, such as Figure 3B shown; Next, a magnetic and adhesive material 300a is printed on the first magnetic sheet 201 to encapsulate the coil 203 to form a structure 300, as Figure 3C shown; Next, the structure 300 can be subjected to pressure and / or heating to form a magnetic body 350, such as Figure 3D shown; then, the magnetic body 350 can be cut into multiple pieces along a plurality of cutting lines 308a, such as Figure 3E As shown, each of them includes a corresponding coil 203 encapsulated by a corresponding portion 207a of a magnetic body 207, as Figure 2J As shown, one side surface of the end portion 203a, 203b of the wire forming the coil 203 is exposed from the corresponding portion 207a of the magnetic body 207...

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PUM

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Abstract

The invention discloses an electrical component, an inductor and a method of forming the electrical component. The method to form a plurality of inductors in a single process by placing multiple coilson a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.

Description

technical field [0001] The present invention relates to a method for forming an inductor, in particular a method for forming a plurality of inductors in a single process. Background technique [0002] Multifunctional portable electronic products and mobile communication products are getting smaller and smaller, and require different voltages to support LCD screens, wireless communication modules, baseband modules and camera modules. Therefore, the demand for conversion circuits and DC-DC converters has increased significantly, and inductors that affect power conversion efficiency have also become very important. [0003] Traditional inductors are made by compress-packing magnetic powder via coils wound on bumps or pillars, and lead frames are used to form the electrodes of the inductor. However, the use of lead frames requires a lot of space and is not suitable for electrodes of smaller electrical components, such as inductors. In addition, due to the pressure difference b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/02H01F41/076H01F17/00
CPCH01F41/0246H01F41/076H01F17/0006H01F2017/0066H01F27/2852H01F17/04H01F2017/048H01F27/292H01F27/263H01F27/306H01F27/255H01L23/645H01F27/327H01F27/29H01F27/24H01F27/2823H01F27/022H01F27/22H01L25/072H05K1/18H05K2201/1003H05K2201/10166H05K2201/10515H01F41/04
Inventor 魏志宏廖仲凯郭民廉
Owner CYNTEC
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