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A mems microphone chip

A microphone and chip technology, applied in sensors, electrostatic transducers, microphones, electrical components, etc., can solve problems such as slow expansion, diaphragm rupture, and hidden reliability problems, and achieve the effect of improving reliability.

Active Publication Date: 2021-12-14
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The initial microcracks will slowly expand under the action of alternating stress, and eventually the diaphragm will break, resulting in the failure of the MEMS microphone chip, which has serious reliability risks

Method used

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  • A mems microphone chip
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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0029] see figure 1 , Figure 4 as well as Figure 5 , the present invention provides a MEMS microphone chip 100, the chip 100 includes a base 10, a back plate 20 and a diaphragm 30, the base 10 includes a back cavity 12 formed in the middle of the base 10 and a fixing portion surrounding the back cavity 12 11. The back plate 20 and the diaphragm 30 are fixed on the fixing part 11, the diaphragm 30 is arranged between the base 10 and the back plate 20, the diaphragm 30 and the back plate The plates 20 are spaced apart from each other to form a capacitive structure, the vibrating membrane 30 is spaced from the substrate 10 facing it to form a first vibrating space 41 , and the vibrating membrane 30 is spaced from the back plate 20 to form a second vibrating space 44 .

[0030] Specifically, the back plate 20 and the diaphragm 30 form a capacitive stru...

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PUM

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Abstract

The present invention provides a kind of MEMS microphone chip, this chip comprises the substrate that forms back cavity in the middle, the diaphragm that is arranged on described substrate and the back plate that is arranged on the side away from described substrate relative to described diaphragm, and described diaphragm A first vibration space is formed at a distance from the base facing it, and the diaphragm extends toward the direction close to the base to form a blocking structure spaced from the base, and the blocking structure is along the positive direction of the vibration direction of the diaphragm. The projection is located on the edge of the base near the side of the cavity. Through the blocking structure arranged on the vibrating membrane, foreign matter is effectively prevented from entering the first vibration space through the back cavity, and the reliability of the MEMS microphone chip is improved.

Description

【Technical field】 [0001] This patent relates to the field of microphone design, in particular to the design of a MEMS microphone chip. 【Background technique】 [0002] In recent years, mobile communication technology has developed rapidly, and consumers are increasingly using mobile communication devices, such as mobile phones, mobile phones with Internet access, personal digital assistants or other devices for communication on dedicated communication networks, among which microphones are One of the important parts, especially MEMS microphones. [0003] In the actual working scene of the existing MEMS microphone chip, foreign matter from the outside enters between the diaphragm and the substrate through the back cavity, changing the capacitance of the system, thereby affecting the performance of the microphone, and even bringing the risk of short circuit. Foreign matter will exist between the diaphragm and the base for a long time, and it will repeatedly contact or even coll...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R19/04
CPCH04R19/005H04R19/04H04R2201/003
Inventor 柏杨张睿
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD