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Semiconductor structure and forming method thereof

A technology of semiconductor and interconnection structure, applied in the field of semiconductor structure and its formation, can solve the problems of long design time, long chip manufacturing time and high cost, and achieve the effect of reducing the overall design time and complexity, and reducing the manufacturing time and cost.

Active Publication Date: 2020-10-13
ICLEAGUE TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing chip manufacturing time is long, the cost is high, and the overall design time is long and the design complexity is high

Method used

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  • Semiconductor structure and forming method thereof
  • Semiconductor structure and forming method thereof
  • Semiconductor structure and forming method thereof

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Embodiment Construction

[0036] As mentioned in the background art, in order to meet artificial intelligence’s requirement for more functions on a single simulation chip, two wafers with different functional modules are usually bonded, and the bonded wafers are cut to form several function chip.

[0037] However, when a chip with different functions is required, a new design of the whole chip is required, which not only results in longer chip manufacturing time and higher cost, but also leads to longer overall chip design time and high design complexity.

[0038] In order to solve the above technical problems, the technical solution of the present invention provides a method for forming a semiconductor structure, by forming a first peelable structure in each first chip area, and forming a second peelable structure on the first peelable structure. The structure is stripped to reduce the overall design time and complexity of the chip, and to reduce the manufacturing time and cost of the chip.

[0039] ...

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Abstract

The invention relates to a semiconductor structure and a forming method thereof. The method comprises the steps: providing a first substrate which comprises a plurality of first chip regions which areseparated from each other; forming a first peelable structure in each first chip area, the first peelable structure comprising a first occupation layer and a first peelable film arranged between thefirst occupation layer and the first substrate; and forming a second peelable structure on the first peelable structure, the second peelable structure comprising a second occupation layer arranged onthe surface of the first occupation layer and a second peelable film arranged on the top surface of the first peelable film and the side wall surface of the second occupation layer. Thus, the overalldesign time and complexity of the chip can be reduced, and the manufacturing time and cost of the chip can be reduced.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor structure and a forming method thereof. Background technique [0002] Today, the application of artificial intelligence appears in more and more fields, such as autonomous driving, image recognition, medical diagnosis, games, financial data analysis and search engines, etc. [0003] In order to meet artificial intelligence's requirement for more functions on a single simulation chip, two wafers with different functions are usually bonded so that a single simulation chip has different functions. [0004] However, the manufacturing time of existing chips is long and the cost is high, and the overall design time is long and the design complexity is high. Contents of the invention [0005] The technical problem solved by the present invention is to provide a semiconductor structure and its forming method, so as to reduce the overall design time and comple...

Claims

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Application Information

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IPC IPC(8): H01L21/78H01L27/02
CPCH01L21/7806H01L27/0207
Inventor 余兴
Owner ICLEAGUE TECH CO LTD