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Digital holographic surface three-dimensional topography measurement system and imager

A technology of three-dimensional morphology and digital holography, applied in the field of three-dimensional imaging, can solve the problems that the three-dimensional imaging system cannot meet the needs of scientific research

Active Publication Date: 2020-10-16
北京钛极科技有限公司
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Problems solved by technology

[0003] However, the current 3D imaging system can no longer meet the needs of scientific research

Method used

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  • Digital holographic surface three-dimensional topography measurement system and imager
  • Digital holographic surface three-dimensional topography measurement system and imager
  • Digital holographic surface three-dimensional topography measurement system and imager

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0055] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0056] refer to figure 1 , figure 1 It is a schematic structural diagram of a digital holographic surface three-dimensional topography measurement system provided by an embodiment of the present invention.

[00...

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Abstract

According to the digital holographic surface three-dimensional topography measurement system and the imager provided by the invention, micron-scale precision surface three-dimensional structure imaging under a centimeter-scale field of view can be realized by the arranged objective lens module interface when any objective lens module is not assembled. When imaging requirements of other actual conditions such as partial cell imaging and MEMS system imaging are met, different objective lens modules are assembled on the objective lens module interface to meet different transverse resolution requirements and view field range requirements. Moreover, a self-aggregation module is arranged in the digital holographic surface three-dimensional topography measurement system, the focal length and theimaging view field size can be adjusted in real time, thus varying planar resolution, and enabling the system to be suitable for measurement requirements of more application scenes; the digital holographic surface three-dimensional topography measurement system comprises a single-wavelength digital holographic microscopic imaging mode, a dual-wavelength digital holographic microscopic imaging modeand a multi-wavelength digital holographic microscopic imaging mode, and the axial resolution can be changed by switching different light source modules.

Description

technical field [0001] The invention relates to the technical field of three-dimensional imaging, and more specifically, relates to a digital holographic surface three-dimensional shape measurement system and an imager. Background technique [0002] With the continuous development of science and technology, various imaging systems have been widely used in people's work, which provides great convenience for the development of scientific research. [0003] However, the current 3D imaging system can no longer meet the needs of scientific research. Contents of the invention [0004] In view of this, in order to solve the above problems, the present invention provides a digital holographic surface three-dimensional shape measurement system and imager, the technical solution is as follows: [0005] A digital holographic surface three-dimensional shape measurement system, said digital holographic surface three-dimensional shape measurement system comprising: [0006] The first ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/24
CPCG01B11/2441
Inventor 王喆邹如飞
Owner 北京钛极科技有限公司
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