A kind of production method of manufacturing 12-inch wafer with 8-inch wafer production line

Abstract

The application provides a production method for manufacturing a 12-inch wafer with an 8-inch wafer production line, comprising the following steps: S1, taking the sheet, obtaining a 12-inch wafer, the thickness of the 12-inch wafer is 700um; S2, serial number 12-inch wafers are divided into 4 parts of the same size and each part is numbered; S3, slicing, each part after numbering is cut so that the 12-inch wafers are equally divided into 4 sub-wafers; S4, Edge trimming, trimming the two corners of the sub-wafer away from its center; S5, thinning, thinning the trimmed sub-wafer; S6, dicing, thinning the sub-wafer Dicing the wafer; S7, loading, loading the diced sub-wafers and packaging each sub-wafer into a 12-inch wafer according to the number; step S4‑S7 is processed by an 8-inch wafer production line . The production method can realize the purpose of manufacturing 12-inch wafers in an 8-inch wafer production line, which effectively relieves the economic pressure of small factories and is conducive to promoting the development of semiconductors and the economy.

Description

technical field [0001] The application belongs to the technical field of wafer production, and more specifically relates to a production method for manufacturing 12-inch wafers with an 8-inch wafer production line. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. [0003] At present, the chip manufacturing process can be summarized as wafer processing process, wafer packaging and testing process, wafer construction process and testing process. Among them, wafer processing process and wafer packaging and testing process are referred to as wafer front-end process, and The assembly process and testing process are referred to as wafer back-end processes for short. Among them, the wafer front-end proce...

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Problems solved by technology

[0006] The purpose of the embodiment of the present application is to provide a production method for manufacturing 12-inch wafers with an 8-inch wafer production line to solve the technical problem that 8-inch wafer equipment cannot produce 12-inch wafers in the prior art

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