Polishing device
A technique for polishing devices and polishing discs, which is applied in the direction of grinding drive devices, surface polishing machine tools, grinding/polishing equipment, etc., and can solve the problems of increasing wafer production costs, prolonging wafer manufacturing time, and reducing wafer production efficiency, etc. problems, to achieve the effect of improving production efficiency, reducing investment, and saving polishing time
Inactive Publication Date: 2020-10-23
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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Problems solved by technology
[0003] However, after performing chemical mechanical polishing on the back of the wafer, it is necessary to introduce other equipment to perform chemical mechanical polishing on the front of the wafer, which not only prolongs the time of wafer manufacturing, but also reduces the production efficiency of the wafer. It also increases the equipment used for wafer production, which increases the production cost of wafers
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[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] This embodiment provides a polishing device, which is applied to a wafer 100, combined with figure 1 , The polishing device includes: an upper polishing disc 200, a lower polishing disc 300, a limiting disc 400 and a driving mechanism. Wherein, the upper polishing disc 200 is located on the side of the limiting disc 400 facing the fir...
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The invention provides a polishing device. The polishing device is applied to a wafer and comprises an upper polishing disc, a lower polishing disc, a limiting disc and a driving mechanism; the upperpolishing disc is located on the side, facing the first direction, of the limiting disc, the lower polishing disc is located on the side, facing the second direction, of the limiting disc, and the first direction and the second direction are opposite; the rotating center of the lower polishing disc, the rotating center of the limiting disc and the rotating center of the upper polishing disc are located on the same rotating center line; the limiting disc is used for bearing the wafer, and the wafer penetrates through the limiting disc in the first direction; and the driving mechanism is used for driving the upper polishing disc and the lower polishing disc to rotate relative to the rotating center line so that the upper polishing disc and the lower polishing disc can polish the two oppositeends of the wafer correspondingly. According to the polishing device, two opposite surfaces of the wafer can be polished at the same time.
Description
technical field [0001] The invention relates to the technical field of semiconductor production equipment, in particular to a polishing device. Background technique [0002] During the wafer manufacturing process, it is usually necessary to perform chemical mechanical polishing on the back of the wafer to remove particles on the back of the wafer. [0003] However, after performing chemical mechanical polishing on the back of the wafer, it is necessary to introduce other equipment to perform chemical mechanical polishing on the front of the wafer, which not only prolongs the time of wafer manufacturing, but also reduces the production efficiency of the wafer. The equipment used for wafer production is also increased, which increases the production cost of wafers. Contents of the invention [0004] In order to solve the above problems, the polishing device provided by the present invention can simultaneously polish the two opposite surfaces of the wafer through the upper p...
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Login to View More IPC IPC(8): B24B29/02B24B47/12B24B41/06B24B41/00
CPCB24B29/02B24B41/00B24B41/06B24B47/12
Inventor 具滋贤张月卢一泓刘青
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI