Sapphire polishing process
A sapphire and process technology, applied in the field of sapphire polishing, can solve the problems affecting the large-scale industrial application of sapphire crystal slices, low processing efficiency, and hindering sapphire, so as to save polishing time, save costs, and increase stability.
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Embodiment 1
[0019] A kind of sapphire polishing process, specifically comprises the following steps:
[0020] S1, raw material pretreatment, the sapphire raw material is put into the grinder, and abrasive is added, wherein the abrasive is selected as a polycrystalline diamond powder with a diameter of 20um and the content is 25%, pure water 68%, composite active agent 0.5% and regulator 6.5%, Grinding time is 6h, obtains sapphire coarse material;
[0021] S2, fine grinding, with the sapphire abrasive obtained in S1, the polycrystalline diamond powder content of 1um in diameter is 25%, pure water 68%, composite active agent 0.5% and regulator 6.5%, and the grinding time is 4h to obtain sapphire fine abrasive;
[0022] S3, polishing, the sapphire fine abrasive obtained in S2 is placed on a polishing machine, the number of revolutions of the polishing machine is 80rpm, and when the pressure value is 4psi, the ratio of the aluminum oxide powder within the particle size of 150nm to pure water...
Embodiment 2
[0026] A kind of sapphire polishing process, specifically comprises the following steps:
[0027] S1, raw material pretreatment, sapphire raw material is put into grinding machine, adds abrasive, and wherein abrasive selects the polycrystalline diamond powder content that diameter is 25um to be 28%, pure water 66%, compound active agent 0.4% and regulator 5.6%, Grinding time is 7h, obtains sapphire coarse material;
[0028] S2, fine grinding, with the sapphire abrasive obtained in S1, through the polycrystalline diamond powder with a diameter of 0.5, the content is 26%, pure water 66%, composite active agent 0.5% and regulator 7.5%, and the grinding time is 4h to obtain sapphire fine abrasive;
[0029] S3, polishing, the sapphire fine abrasive obtained in S2 is placed on a polishing machine, the number of revolutions of the polishing machine is 130rpm, and when the pressure value is 5psi, the ratio of the aluminum oxide powder within the particle size of 200nm to pure water i...
Embodiment 3
[0033] A kind of sapphire polishing process, specifically comprises the following steps:
[0034] S1, raw material pretreatment, the sapphire raw material is put into the grinder, and abrasive material is added, wherein the abrasive material selects polycrystalline diamond micropowder with a diameter of 25um and the content is 23%, pure water 70%, composite active agent 0.5% and regulator 6.5%, Grinding time is 8h, obtains sapphire coarse material;
[0035] S2, fine grinding, with the sapphire abrasive obtained in S1, through the polycrystalline diamond powder with a diameter of 0.5, the content is 23%, pure water 70%, composite active agent 0.5% and regulator 6.5%, and the grinding time is 5h to obtain sapphire fine abrasive;
[0036] S3, polishing, the sapphire fine abrasive obtained in S2 is placed on a polishing machine, the number of revolutions of the polishing machine is 150rpm, and when the pressure value is 7psi, the ratio of the aluminum oxide powder within the part...
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