Integrated 3D uniform temperature plate and manufacturing method thereof

Abstract

The invention relates to the technical field of uniform temperature plates, in particular to an integrated 3D uniform temperature plate and a manufacturing method thereof. The integrated 3D uniform temperature plate comprises a second plate body, the second plate body is in a groove shape, an opening in the upper end of the second plate body is covered with a first plate body and is welded and sealed, a first capillary plate and a second capillary plate are arranged in a groove-shaped inner cavity of the second plate body in a stacked mode, a plurality of inserting holes are formed in the outer wall of the first capillary plate and the outer wall of the second capillary plate, supporting columns are connected into the inserting holes in an inserted mode, a pair of heat pipe inserting holesis formed in the upper end face of the first plate body, flange rings are welded to the heat pipe inserting holes, and heat pipes are connected into the flange rings in an inserted mode. According tothe integrated 3D uniform temperature plate and the manufacturing method thereof, the problems that capillary surface cutoff occurs when the uniform temperature plate and a heat pipe are combined andlong and short pipes (different insertion depths) appear in the combination process of the heat pipe and an uniform temperature plate body in production engineering are solved, the heat conduction efficiency after the uniform temperature plate and the heat pipe are combined into a whole can be greatly improved, and the product yield and the heat dissipation effect of a product are improved.

Description

technical field [0001] The invention relates to the technical field of temperature chambers, in particular to an integrated 3D temperature chamber and a manufacturing method thereof. Background technique [0002] With the increasingly powerful electronic equipment chips required by the technology industry chain, the application of 5G technology, the Internet of Things, and the Internet of Vehicles is rapidly expanding. At the same time, it will also pose a greater challenge to the heat dissipation treatment technology; however, the traditional vapor chamber module is still manufactured by welding the heat pipe with the vapor chamber, and the welding surface produces a large The thermal resistance value makes the overall performance of the vapor chamber and the heat pipe unable to be fully utilized. Faced with the current situation, the industry peers are currently conducting research on the integrated vapor chamber technology; some companies in the industry have made breakth...

AI Technical Summary

Problems solved by technology

[0002] With the increasingly powerful electronic equipment chips required by the technology industry chain, the application of 5G technology, the Internet of Things, and the Internet of Vehicles is rapidly expanding. At the same time, it will also pose a greater challenge to the heat dissipation treatment technology; however, the traditional vapor chamber module is still manufactured by welding the heat pipe with the vapor chamber, and the welding surface produces a large The thermal resistance value makes the overall performance of the vapor chamber and the heat pipe unable to be fully utilized. Faced with the current situation, the industry peers are currently conducting research on the integrated vapor chamber technology; some companies in the industry have made breakthroughs. However, the yield rate of the products produced and processed is not very good, so that the production capacity is insufficient, and the price is 2-3 times that of the traditional vapor chamber welding heat pipe module. The application is extremely limited, and only some of its high-end products will be used.

Images