Heat dissipation structure and power module

A technology of heat dissipation structure and power module, which is applied to printed circuits, electrical components, and electrical solid devices connected with non-printed electrical components, and can solve the problems of low heat dissipation efficiency and unbalanced heat of power modules.

Active Publication Date: 2020-10-23
KEHUA DATA CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the heat in the power module is not balanced, and the heat is...

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  • Heat dissipation structure and power module
  • Heat dissipation structure and power module
  • Heat dissipation structure and power module

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are preferred embodiments of the invention and should not be seen as excluding other embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0045] In the claims, description and above-mentioned drawings of the present invention, unless otherwise clearly defined, the terms "first", "second" or "third" are used to distinguish different objects, not for Describe a specific order.

[0046] In the claims, specification and above-mentioned drawings of the present invention, unless otherwise clearly defined, for orientation words, such as using the terms "center", "transverse", "longit...

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Abstract

The invention discloses a heat dissipation structure, which comprises a first radiator, a second radiator and a heat conduction unit, wherein the first radiator is used for dissipating heat of a firstpower unit, and is provided with a first heat dissipation pedestal having first heat dissipation fins; the second radiator is arranged opposite to the first radiator, is used for dissipating heat ofa second power unit, and is provided with a second heat dissipation pedestal having second heat dissipation fins; and the two surfaces, deviating from each other and parallel to each other, of the heat conduction unit are attached to the opposite end faces of the first heat dissipation pedestal and the second heat dissipation pedestal correspondingly, and the heat conduction unit is used for conducting heat between the first radiator and the second radiator. Correspondingly, the invention further provides a power module adopting the heat dissipation structure. According to the heat dissipationstructure and the power module, the heat of the first radiator and the heat of the second radiator are conducted, local high-temperature points of the first power unit and the second power unit are reduced, the temperature is more balanced, and therefore the heat dissipation structure and the power module can cope with different limit working conditions, and the heat dissipation efficiency is improved under the condition of the same cost.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a power module. Background technique [0002] At present, the power of power electronic modules continues to increase, and the problem of heat dissipation is becoming more and more prominent. Heat dissipation technology has become the main factor restricting the growth of module power. Improving the temperature uniformity of each power device and the efficiency of heat dissipation equipment can reduce the limitation of heat dissipation factors on power density at low cost and prolong the service life of equipment. [0003] Existing heat dissipation designs often combine power devices with various functions into different units and place them on different heat sinks, that is, each heat sink corresponds to a power unit, and the heat dissipation paths of each heat sink are independent. When the power unit is not working or the loss is low, ...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/373H01L23/467H05K1/18
CPCH01L23/367H01L23/467H01L23/3738H05K1/181
Inventor 卢艺杰傅伟堃倪泽联赵晓航
Owner KEHUA DATA CO LTD
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