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A clamping device for cutting heat sink of computer graphics card

A clamping device and cooling fin technology, applied in the direction of workpiece clamping devices, manufacturing tools, etc., can solve the problems of easy vibration, affecting work efficiency, inconvenient blanking, etc., achieve fast locking and unlocking, improve the supporting effect, The effect of increasing the heat dissipation area

Active Publication Date: 2021-08-10
GUIZHOU INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Due to the relatively simple structure of the existing clamping device, it is easy to vibrate when cutting the heat sink, which affects the quality of the slit heat sink. In addition, the simple clamping cannot guarantee the stability of the clamping ;
[0005] 2. The existing clamping device is not equipped with an ejector device, which is inconvenient for unloading and affects work efficiency after the slitting is completed;
[0006] 3. As mentioned above, most of the existing heat sinks use copper bases and aluminum fins to cooperate, and the heat dissipation effect needs to be improved; therefore, how to improve the heat dissipation effect and improve the processing efficiency in a limited space has become the focus of attention

Method used

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  • A clamping device for cutting heat sink of computer graphics card
  • A clamping device for cutting heat sink of computer graphics card
  • A clamping device for cutting heat sink of computer graphics card

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Embodiment Construction

[0032] see Figure 1~4 , in an embodiment of the present invention, a clamping device for cutting heat sinks of computer graphics cards, which includes a base 1, a mounting seat 2, a moving arm 5, a locking assembly 6, a supporting assembly 7, and a processing table 10, wherein the The mounting seat 2 is fixed on the base 1, and the mounting seat 2 is a cavity structure, and an opening is provided on the top thereof for the processing table 10 to move up and down along the opening;

[0033] Wherein, the middle part of the processing table 10 is provided with an accommodating groove 13, and the bottom of the accommodating groove 13 is uniformly arranged with a vertically placed pit-shaped needle 11, and the top of the pit-shaped needle 11 is spherical, And it is used to place the heat sink 12 to be cut;

[0034] Both sides of the mounting base 2 are symmetrically provided with moving arms 5 capable of horizontal displacement, and each of the moving arms 5 is provided with a lo...

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PUM

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Abstract

The invention discloses a clamping device for cutting a computer graphics card heat sink, which comprises a base, a mounting seat, a moving arm, a locking assembly, a top support assembly and a processing table, wherein the mounting seat is fixed on the base , the mounting seat is a cavity structure, and its top is provided with an opening for the processing table to move up and down along its opening; a accommodating groove is opened in the middle of the processing table, and the bottom of the accommodating groove is Vertically placed pit-shaped pins are evenly distributed, and the top of the pit-shaped pins is spherical and is used to place the heat sink to be cut; the two sides of the mounting seat are symmetrically arranged with moving arms capable of horizontal displacement, Each of the moving arms is provided with a locking assembly. When clamping and locking the heat sink to be cut, the locking assembly can support the processing table upward through the top support assembly while dissipating heat to be cut. The fins are locked on the dimple shape needles, so as to realize the shape of the dimples on the heat sink to be cut.

Description

technical field [0001] The invention relates to the technical field of clamping devices, in particular to a clamping device for cutting heat sinks of computer graphics cards. Background technique [0002] As a heat conduction medium for the GPU, the heat sink of the graphics card can increase the heat exchange area of ​​the chip to achieve the purpose of rapid heat dissipation. Usually, this type of heat sink uses a copper base and aluminum fins to match, and the copper base It is in contact with the chip, and multiple sets of fins are welded on the copper base to maximize the heat dissipation area. Before welding, the heat sink needs to be cut into the required size, so a clamping device is needed for assistance processing. [0003] After investigation and analysis, the existing clamping device and the heat dissipation of aluminum fins have the following problems: [0004] 1. Due to the relatively simple structure of the existing clamping device, it is easy to vibrate whe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B25B11/00
CPCB25B11/00
Inventor 王喜宾丁阿丹杨剑锋郭晟南
Owner GUIZHOU INST OF TECH
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