Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Welding seam surface topography three-dimensional imaging device

A welding seam surface, three-dimensional imaging technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of easy loss, vibration sensitivity, missed detection, etc.

Inactive Publication Date: 2020-10-30
武汉新耐视智能科技有限责任公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The actual detection results show that due to the complex environmental conditions of weld detection, there are many problems in the actual imaging of this principle, such as being easily disturbed by ambient temperature and strong light, and also sensitive to vibration; , micropores and other defects, this method is easy to lose features during the imaging process, which leads to missed detection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Welding seam surface topography three-dimensional imaging device
  • Welding seam surface topography three-dimensional imaging device
  • Welding seam surface topography three-dimensional imaging device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The present application will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0034] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0035] It should be noted that the technical solutions described in the embodiments of the present invention may be combined arbitrarily if there is no conflict.

[0036] figure 1 A schematic diagram showing an optional structural composition of the three-dimensional im...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a welding seam surface topography three-dimensional imaging device. The imaging device comprises a light source assembly, an interference assembly, an image acquisition assembly and an imaging assembly; the light source assembly is used for emitting light beams required for measuring the surface of a weld joint; the interference assembly is used for receiving the light beams emitted by the light source assembly, reflecting a first path of light beams in the light beams and transmitting a second path of light beams in the light beams; the second path oflight beams is transmitted to the surface of the weld joint; the reflected light beams of the second path of light beams are received; interference light beams formed by the first path of light beamsand the reflected light beams are emitted; the image acquisition assembly is used for acquiring the interference light beams emitted by the interference assembly to obtain an interference image; andthe imaging assembly is used for determining depth information of the surface of the weld joint based on interference fringes formed by the interference light beams in the interference image acquiredby the image acquisition assembly, and performing three-dimensional imaging on the surface of the weld joint based on the depth information.

Description

technical field [0001] The invention relates to imaging technology, in particular to a three-dimensional imaging device for weld surface topography. Background technique [0002] Welding is widely used in the fields of aerospace, automobiles and ships. As one of the effective means of welding quality assessment, weld quality inspection is of great significance for ensuring welding quality, improving welding process and increasing the life of parts. The efficiency and quality of weld formation inspection is directly related to the production efficiency and automation of the production line, and it also plays a positive role in saving labor and improving the working environment of workers. [0003] At present, the surface quality inspection of welds is still mainly based on manual visual observation (or supplemented by grinding). The inspection accuracy depends on the experience and level of the operator, and the inspection efficiency is very low and the quality fluctuates gre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/24G01B9/02
CPCG01B9/02057G01B11/2441
Inventor 蒋平李斌程思滑双东
Owner 武汉新耐视智能科技有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com