Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method and application of a chip type micro filter capacitor

A filter capacitor and chip type technology, which is used in the preparation of chip micro filter capacitors. With the help of micro-nano processing technology to customize the field of chip micro filter capacitors, it can solve the problem that the fixed connection method is not reliable and stable enough, and it is inconvenient to lead. The problems of bonding with the circuit board, such as conduction, micro-short circuit, and low ion transfer efficiency, can achieve stable and reliable integration effects, broaden the characteristic parameters and application scope, and improve the effect of space utilization.

Active Publication Date: 2021-10-08
HUAZHONG UNIV OF SCI & TECH
View PDF14 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the existence of the diaphragm, the traditional supercapacitor with a sandwich structure is prone to micro-short circuit, low ion transfer efficiency, and the upper and lower electrodes are not convenient for the bonding of the lead wire and the circuit board to conduct electricity.
At present, most filter capacitors are fixed and connected to the circuit board through two or more pins, which occupy a large area of ​​the circuit board and are not suitable for circuit boards with a small space, and the pins are easy to bend, and the fixed connection method is not reliable enough. Stable, not suitable for applications with strong shock or vibration

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method and application of a chip type micro filter capacitor
  • Preparation method and application of a chip type micro filter capacitor
  • Preparation method and application of a chip type micro filter capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] The 3D silicon-based capacitor includes a 3D silicon-based frame 100 , a current collector 101 , an active material 102 , an encapsulation case (including a supporting encapsulation case lower part 103 a and an encapsulation case upper part 103 b ), electrolyte 104 , conductive pins 105 and a circuit board 106 . Its preparation method may comprise the following steps:

[0052] 1. Fabrication of the 3D silicon-based frame 100 . Silicon wafers are used for semiconductor patterning processing to form a pair of comb-shaped electrodes, which serve as the overall 3D frame of the capacitor, such as figure 1 As shown, wherein, the length, width and height of the comb teeth can be flexibly designed and selectively designed on demand. The present invention aims to design miniaturized capacitors. Can;

[0053] Two, the conductive carbon material is used as the making of current collector 101, such as figure 1 shown. For this high aspect ratio 3D frame, the current collector 10...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
heightaaaaaaaaaa
widthaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the cross-technical field of filter capacitors, micro-nano manufacturing technology and electronic circuits, and discloses a preparation method and application of a chip-type micro-filter capacitor, which adopts a patterned 3D silicon-based frame (100) to conduct current collectors ( 101) and the coating of active material (102), make the electrode of capacitor, fix it on the lower part (103a) of the packaging case, coat the electrolyte (104); finally package the upper part of the case (103b) and reserve a conductive connection point, The conductive pin (105) is embedded in the shell to realize the chip design conductive pin of the capacitor. The present invention designs the overall flow process of the chip-type micro-filter capacitor, and realizes the customized manufacturing of the chip electrode through the semiconductor process; adopts a simple packaging structure, which is convenient for sealing; and manufactures a pair of embedded conductive pins with adjustable dimensions. The circuit board is electrically connected by spot welding, which ensures connection reliability and miniaturized integration. Finally, it is actually applied to the patch circuit board to realize the filtering function.

Description

technical field [0001] The invention belongs to the cross-technical field of filter capacitors, micro-nano manufacturing technology and electronic circuits, and more specifically, relates to a preparation method and application of a chip-type micro-filter capacitor, which is a customized manufacturing chip by means of micro-nano processing technology. The method of formulating miniature filter capacitors. Background technique [0002] The filter is an electrical component used to reduce or eliminate the influence of harmonics on the power system. It consists of a filter circuit composed of capacitors, inductors and resistors. Using its frequency selection function, you can filter out interference noise or perform spectrum analysis. For capacitors, its application fields are very wide, and it plays an important role in filtering, energy storage, bypass, coupling, timing, etc. in electronic circuits. Among these applications, filtering applications are the most common applic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01G11/84H01G11/86H01G11/74H01G11/68H01G11/26H01L23/64
CPCH01G11/26H01G11/68H01G11/74H01G11/84H01G11/86H01L28/40
Inventor 王玉容孙雷蒙赵纯肖东阳杜欢欢涂良成
Owner HUAZHONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com