Laser processing device with controllable light beam incident angle and laser processing method

A technology of laser processing and incident angle, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of expensive device, small diameter, less than 2 mm, etc., and achieve simple device structure and simple control algorithm. , to achieve the effect of laser processing with a wide range of inclination angles

Pending Publication Date: 2020-11-03
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of this type of technology is that the machining of high roundness and predetermined taper can be realized through the rotation of the wedge-shaped module, but the disadvantage is that due to the combination of multiple motor precision movements, this type of device is generally expensive, and the diameter of the hole that can be direc

Method used

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  • Laser processing device with controllable light beam incident angle and laser processing method
  • Laser processing device with controllable light beam incident angle and laser processing method
  • Laser processing device with controllable light beam incident angle and laser processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Laser processing equipment such as image 3 As shown, it includes a laser generating unit and a hollow unit 5 , and the laser generating unit includes a laser 1 , an optical modulator 2 and a focusing device 3 . The beam emitted by the laser 1 is coupled into the focusing unit 3 through the optical modulator 2. After focusing, it emits a beam with a focal length F. The direction of the central axis of the beam is the axis E. The beam is incident on the surface of the workpiece 8 after passing through the hollow unit.

[0055] The hollow unit 5 is provided with a first reflector 6A and a second reflector 6B. The light beam emitted by the laser generating unit is irradiated on the first reflector, reflected by the first reflector and then irradiated on the second reflector, and reflected by the second reflector. Irradiate on the workpiece 8 surface.

[0056] Such as figure 2 As shown, the included angle th1 between the axis E and the first mirror surface is the inclina...

Embodiment 2

[0076] In this embodiment, the structure of the laser processing device is basically the same as that of Embodiment 1, except that the focusing device is a long focal length lens, and the focal length of the beam after focusing is 1000mm; the hollow rotating head is installed on an electric translation platform, and the hollow unit Connected with the displacement unit, the displacement unit is an electric translation platform, the hollow unit can be displaced in the axial E direction on the electric translation platform, and the displacement stroke is + / -200 mm, so as to adjust L1.

[0077] Table 3 has shown each parameter of this laser processing device when focal length F=1000 millimeters, for example:

[0078] When the inclination angle of the first reflector is 45°, in order to realize the inverse cone processing with an incident angle of 3°, use the difference to adjust the inclination angle of the second reflector to 43.5°;

[0079] When the inclination angle of the firs...

Embodiment 3

[0088] In this embodiment, the structure of the laser processing device is basically the same as that in Embodiment 2, except that the focusing device is a scanning galvanometer. When the hollow unit is rotated, the fixed-point tilt mode is used, that is, the hollow unit is rotated to a certain position, and the incident angle of the beam is incident by adjusting the difference between the first mirror and the second mirror. Combined with the scanning galvanometer, local complex shapes can be realized. Controlled taper processing.

[0089] For example, if Figure 4 As shown, the hollow unit is rotated to the static position when the system θ=0°, 90°, 180°, and 270° respectively, and the beam incident angle th3 is adjusted to the required processing inclination angle, and the galvanometer system scans to obtain Figure 4 Shown are shapes with certain tapers at θ = 0°, 90°, 180°, 270°.

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Abstract

The invention provides a laser processing device with a controllable light beam incident angle and a laser processing method. The laser processing device comprises a laser generating unit and a hollowunit, the laser generating unit emits a light beam with a focal length F and an axial direction E, and the light beam is incident on the surface of a workpiece after passing through the hollow unit;the hollow unit is provided with a first reflecting mirror and a second reflecting mirror, and the light beam emitted by the laser generating unit irradiates a first reflecting mirror surface, irradiates a second reflecting mirror surface after being reflected by the first reflecting mirror surface and irradiates the surface of the workpiece after being reflected by the second reflecting mirror surface; and by adjusting the inclination angle of the first reflecting mirror surface and/or the inclination angle of the second reflecting mirror surface, the light beam incident angle can be adjustedand controlled, so that laser processing of any light beam incident angle can be realized, particularly large-angle light beam incidence can be obtained, taper-controllable laser rotary processing can be obtained when the hollow unit rotates, and the device and the method have the good application prospects in processing of laser drilling, laser milling, laser polishing, laser cutting, laser welding and the like.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing device and a laser processing method with controllable beam incident angles. Background technique [0002] Laser processing is a processing method that combines laser beams with workpieces to achieve multiple purposes, such as drilling, cutting, scribing, welding, heat treatment, etc. [0003] In many occasions, it is necessary to realize the inclination processing of the workpiece, that is, the laser beam forms a certain angle with the surface of the workpiece during processing. For example, laser drilling generally needs to focus the parallel laser beam. Through the relative movement of the laser and the material, the interaction between the laser pulse and the material is used for processing. When the laser beam forms a certain angle with the workpiece surface during laser drilling, it can be obtained. Holes with a certain taper, currently controll...

Claims

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Application Information

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IPC IPC(8): B23K26/082B23K26/064B23K26/06
CPCB23K26/0821B23K26/064B23K26/0643B23K26/0648
Inventor 张文武张天润章鹏
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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