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Material scheduling method

A scheduling method and material technology, applied in the direction of instruments, manufacturing computing systems, electrical components, etc., can solve problems affecting user experience, weakening software functions, etc., and achieve the effect of improving material processing capacity

Pending Publication Date: 2020-11-03
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing technology does not support the conflict of two PMs setting ST Enable, nor does it support the conflict of chamber Enable and priority attribute settings. This restriction greatly weakens the software function, thus affecting the user experience

Method used

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Examples

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Embodiment Construction

[0051] The present invention will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0052] figure 1 A flowchart showing the steps of a material scheduling method according to the present invention.

[0053] Such as figure 1 As shown, a material scheduling method according to the present invention is used for semiconductor equipment. The semiconductor equipment includes at least one process module, and each process module includes at least one process chamber. The method includes:

[0054] S101: Group the materials in the material queue in turn according to the curr...

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Abstract

The invention discloses a material scheduling method, which comprises the following steps of: grouping materials in a material queue in sequence according to the current attributes of process chambersin all process modules, and marking a process module identifier into which each material enters, wherein the number of the materials in each material group formed by grouping corresponds to the number of the process chambers of which the current attributes are available in the marked process module; according to the grouping result, marking the materials as the same process module identifier aresimultaneously transmitted into process chambers with available current attributes in the corresponding process modules; and in the introduction process, the change of the occupation state of each process chamber is monitored in real time, the materials which are not introduced into the process chamber are regrouped according to the current occupation state of each process chamber, and the processmodule identification to be introduced is marked again. A plurality of materials can be grouped and a plurality of materials can be conveyed in at the same time, material grouping is dynamically adjusted, and the machining capacity of equipment is improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and more specifically, to a material scheduling method. Background technique [0002] In the process of processing multiple materials in the existing multi-process chamber semiconductor equipment, its scheduling algorithm can set the material processing priority according to the material storage location according to the actual material scanning results, and then process one piece of material at a time according to its priority. Each material is the monitoring object of the algorithm, and once the position of the material changes, the scheduling algorithm is updated once. [0003] Taking an existing machine equipment as an example, the structure of the machine equipment is as follows: [0004] (1) 3 Foup / Adapter (wafer transfer box / adapter): each Foup / Adapter can hold 25 pieces of materials, compatible with 8-inch and 12-inch. [0005] (2) 2 manipulators: E...

Claims

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Application Information

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IPC IPC(8): G06Q10/06G06Q50/04H01L21/67
CPCG06Q10/06312G06Q50/04H01L21/67155Y02P90/30
Inventor 吴洁
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD